Showing 1 - 1 results of 1 for search '"Sn-Ag-Cu solder"', query time: 0.04s Refine Results
  1. 1
    Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue

    Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue by Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang

    Published 2025-01-01
    Subjects: “…Sn-Ag-Cu solder…”
    Get full text
    Article
    Save to List
    Saved in:

Search Tools: