Showing 1 - 1 results of 1 for search '"SiC packaging"', query time: 0.14s Refine Results
  1. 1
    Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module

    Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module by Wei Mu, Laili Wang, Haoyuan Jin, Borong Hu, Binyu Wang, Jinfeng Zhang, Liang Wang, Teng Long

    Published 2025-01-01
    Subjects:
    Get full text
    Article
    Save to List
    Saved in:

Search Tools: