Showing 861 - 880 results of 896 for search '"Semiconductors"', query time: 0.05s Refine Results
  1. 861

    Electrodeposited CdTe solar cells using low-purity Cd precursors & the effect of chemical purity by Ashfaque E. Alam, Hussain I. Salim, Ayotunde A. Ojo, Imyhamy M. Dharmadasa

    Published 2024-05-01
    “…Glass/fluorine-doped tin oxide (FTO) substrates have been used to electrodeposit the semiconductor layers. The as-deposited (AD) layers were heat-treated in the air with CdCl2. …”
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  2. 862

    Fabrication of Cu: ZnO thin film sensor for ethanol vapor detection by Robin Simkhada, Dalton R. Gibbs, Soma Dhakal, Dipak Oli, Rishi Ram Ghimire, Deependra Das Mulmi, Leela Pradhan Joshi

    Published 2025-01-01
    “… For a long time, metal oxide semiconductor (MOS) based gas sensors have been widely used in domestic, commercial, and industrial sectors to detect harmful gases. …”
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  3. 863

    Enhanced energy storage performance in Ag(Nb,Ta)O3 films via interface engineering by Xiao Zhai, Jun Ouyang, Weijie Kuai, Yinxiu Xue, Kun Wang, Nengneng Luo, Hongbo Cheng, Hanfei Zhu, Chao Liu, Limei Zheng

    Published 2025-03-01
    “…A Ag(Nb,Ta)O3/BaTiO3 bilayer film is proposed, where the BaTiO3 layer acts as a p-type semiconductor while Ag(Nb,Ta)O3 layer is n-type, together with the n-type LaNiO3 buffer layer on the substrate, forming an n-p-n heterostructure. …”
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  4. 864

    Neuronal Multi Unit Activity Processing with Metal Oxide Memristive Devices by Caterina Sbandati, Xiongfei Jiang, Deepika Yadav, Spyros Stathopoulos, Dana Cohen, Alex Serb, Shiwei Wang, Themis Prodromakis

    Published 2024-12-01
    “…Furthermore, towards the integration of MIS with silicon chips, it is shown that it can reduce total system power consumption to below 1 µW, as RRAM encoding stage relaxes the signal preservation and noise requirements that challenge traditional complementary metal‐oxide‐semiconductor (CMOS) front‐ends. This eMUA‐MIS adaptation offers a viable pathway for developing more scalable and efficient BMIs for clinical use.…”
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  5. 865

    A Comparative Analysis of Laser-Ablated Surface Characteristics Between the Si Face and C Face of Silicon Carbide Substrates by Hsin-Yi Tsai, Yu-Hsuan Lin, Kuo-Cheng Huang, J. Andrew Yeh, Yi Yang, Chien-Fang Ding

    Published 2025-01-01
    “…Silicon carbide (SiC) has significant potential as a third-generation semiconductor material due to its exceptional thermal and electronic properties, yet its high hardness and brittleness make processing costly and complex. …”
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  6. 866

    Electronically Coupled Heterojunctions Based on Graphene and Cu2−xS Nanocrystals: The Effect of the Surface Ligand by Ju Y. Shang, Mariangela Giancaspro, Adriana Grandolfo, Rafique A. Lakho, Elisabetta Fanizza, Suraj K. Patel, Giuseppe Valerio Bianco, Marinella Striccoli, Chiara Ingrosso, Oscar Vazquez-Mena, M. Lucia Curri

    Published 2024-12-01
    “…While most research has concentrated on systems using heavy metal-based semiconductor NCs, there is a need for further exploration of environmentally friendly nanomaterials, such as Cu<sub>2−x</sub>S. …”
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  7. 867

    Low Thermal Resistance of Diamond‐AlGaN Interfaces Achieved Using Carbide Interlayers by Henry T. Aller, Thomas W. Pfeifer, Abdullah Mamun, Kenny Huynh, Marko Tadjer, Tatyana Feygelson, Karl Hobart, Travis Anderson, Bradford Pate, Alan Jacobs, James Spencer Lundh, Mark Goorsky, Asif Khan, Patrick Hopkins, Samuel Graham

    Published 2025-02-01
    “…This study provides a foundation for future research in improving thermal properties of semiconductor devices through interface engineering and advanced measurement methodologies.…”
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  8. 868

    Photocatalytic Degradation of E.Coli Bacteria by Graphitic Carbon Nitride Photocatalysts under Visible Light Irradiation by Zahra Ahmadi Panah, Reyhaneh Dehghan, Mehran Bijari, Afsaneh Shahbazi

    Published 2024-08-01
    “…Graphitic carbon nitride, as a polymeric semiconductor, has attracted significant attention in this field. …”
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  9. 869

    Polyoxovanadate-modified SnO2 electron transport layer for perovskite photodetectors by Ziting Liu, Yijia Hao, Jing Zhang, Yi He, Weilin Chen

    Published 2025-03-01
    “…Polyoxovanadates (POVs), as semiconductor-like molecules, exhibit good redox and excellent optical properties, which can regulate the energy band structure of SnO2. …”
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  10. 870

    Controlled lattice deformation for high-mobility two-dimensional MoTe2 growth by Ruishan Li, Mengyu Hong, Wei Shangguan, Yanzhe Zhang, Yihe Liu, He Jiang, Huihui Yu, Li Gao, Xiankun Zhang, Zheng Zhang, Yue Zhang

    Published 2025-03-01
    “…Two-dimensional (2D) MoTe2 shows great potential for future semiconductor devices, but the lab-to-fab transition is still in its preliminary stage due to the constraints in the crystal growth level. …”
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  15. 875

    A 5.5–7.5‐GHz band‐configurable wake‐up receiver fully integrated in 45‐nm RF‐SOI CMOS by Rui Ma, Florian Protze, Frank Ellinger

    Published 2022-10-01
    “…Abstract This work investigates a 5.5–7.5‐GHz band‐configurable duty‐cycled wake‐up receiver (WuRX) fully implemented in a 45‐nm radio‐frequency (RF) silicon‐on‐insulator (SOI) complementary‐metal‐oxide‐semiconductor (CMOS) technology. Based on an uncertain intermediate frequency (IF) super‐heterodyne receiver (RX) topology, the WuRX analogue front‐end (AFE) incorporates a 5.5–7.5‐GHz band‐tunable low‐power low‐noise amplifier, a low‐power Gilbert mixer, a digitally controlled oscillator (DCO), a 100‐MHz IF band‐pass filter (BPF), an envelope detector, a comparator, a pulse generator and a current reference. …”
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  20. 880

    Accelerated TLPD bonding of reliable IMCs micro joints using Cu–8Ni substrate under thermal gradient: Experiments and theoretical calculations by Yanqing Lai, Mingjie Wang, Donghui Zheng, Meiping Liu, Bao Chen, Jinmei Lv, Ning Zhao

    Published 2025-03-01
    “…With the rapid development of the third-generation semiconductor power device towards high density, high performance, miniaturization and high temperature resistance, it is now urgent to develop a transient liquid phase diffusion (TLPD) bonding method with short bonding time and high reliability. …”
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