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861
Electrodeposited CdTe solar cells using low-purity Cd precursors & the effect of chemical purity
Published 2024-05-01“…Glass/fluorine-doped tin oxide (FTO) substrates have been used to electrodeposit the semiconductor layers. The as-deposited (AD) layers were heat-treated in the air with CdCl2. …”
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862
Fabrication of Cu: ZnO thin film sensor for ethanol vapor detection
Published 2025-01-01“… For a long time, metal oxide semiconductor (MOS) based gas sensors have been widely used in domestic, commercial, and industrial sectors to detect harmful gases. …”
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863
Enhanced energy storage performance in Ag(Nb,Ta)O3 films via interface engineering
Published 2025-03-01“…A Ag(Nb,Ta)O3/BaTiO3 bilayer film is proposed, where the BaTiO3 layer acts as a p-type semiconductor while Ag(Nb,Ta)O3 layer is n-type, together with the n-type LaNiO3 buffer layer on the substrate, forming an n-p-n heterostructure. …”
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864
Neuronal Multi Unit Activity Processing with Metal Oxide Memristive Devices
Published 2024-12-01“…Furthermore, towards the integration of MIS with silicon chips, it is shown that it can reduce total system power consumption to below 1 µW, as RRAM encoding stage relaxes the signal preservation and noise requirements that challenge traditional complementary metal‐oxide‐semiconductor (CMOS) front‐ends. This eMUA‐MIS adaptation offers a viable pathway for developing more scalable and efficient BMIs for clinical use.…”
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865
A Comparative Analysis of Laser-Ablated Surface Characteristics Between the Si Face and C Face of Silicon Carbide Substrates
Published 2025-01-01“…Silicon carbide (SiC) has significant potential as a third-generation semiconductor material due to its exceptional thermal and electronic properties, yet its high hardness and brittleness make processing costly and complex. …”
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866
Electronically Coupled Heterojunctions Based on Graphene and Cu2−xS Nanocrystals: The Effect of the Surface Ligand
Published 2024-12-01“…While most research has concentrated on systems using heavy metal-based semiconductor NCs, there is a need for further exploration of environmentally friendly nanomaterials, such as Cu<sub>2−x</sub>S. …”
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867
Low Thermal Resistance of Diamond‐AlGaN Interfaces Achieved Using Carbide Interlayers
Published 2025-02-01“…This study provides a foundation for future research in improving thermal properties of semiconductor devices through interface engineering and advanced measurement methodologies.…”
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868
Photocatalytic Degradation of E.Coli Bacteria by Graphitic Carbon Nitride Photocatalysts under Visible Light Irradiation
Published 2024-08-01“…Graphitic carbon nitride, as a polymeric semiconductor, has attracted significant attention in this field. …”
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869
Polyoxovanadate-modified SnO2 electron transport layer for perovskite photodetectors
Published 2025-03-01“…Polyoxovanadates (POVs), as semiconductor-like molecules, exhibit good redox and excellent optical properties, which can regulate the energy band structure of SnO2. …”
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870
Controlled lattice deformation for high-mobility two-dimensional MoTe2 growth
Published 2025-03-01“…Two-dimensional (2D) MoTe2 shows great potential for future semiconductor devices, but the lab-to-fab transition is still in its preliminary stage due to the constraints in the crystal growth level. …”
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871
The Effect of Channel Layer Thickness on the Performance of GaN HEMTs for RF Applications
Published 2024-12-01Get full text
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872
Plasmonically-enhanced reconfigurable photodetector based on graphene/Sb2S3 heterojunction
Published 2025-01-01Get full text
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873
Insulator–metal transition in VO2 film on sapphire studied by broadband dielectric spectroscopy
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874
An impermeable copper surface monolayer with high-temperature oxidation resistance
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875
A 5.5–7.5‐GHz band‐configurable wake‐up receiver fully integrated in 45‐nm RF‐SOI CMOS
Published 2022-10-01“…Abstract This work investigates a 5.5–7.5‐GHz band‐configurable duty‐cycled wake‐up receiver (WuRX) fully implemented in a 45‐nm radio‐frequency (RF) silicon‐on‐insulator (SOI) complementary‐metal‐oxide‐semiconductor (CMOS) technology. Based on an uncertain intermediate frequency (IF) super‐heterodyne receiver (RX) topology, the WuRX analogue front‐end (AFE) incorporates a 5.5–7.5‐GHz band‐tunable low‐power low‐noise amplifier, a low‐power Gilbert mixer, a digitally controlled oscillator (DCO), a 100‐MHz IF band‐pass filter (BPF), an envelope detector, a comparator, a pulse generator and a current reference. …”
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876
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877
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878
Alteration of Mastication Force via Intraoral Closed-Loop Electrical Stimulation
Published 2025-01-01Get full text
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879
Short-Circuit Performance Analysis of Commercial 1.7 kV SiC MOSFETs Under Varying Electrical Stress
Published 2025-01-01Get full text
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880
Accelerated TLPD bonding of reliable IMCs micro joints using Cu–8Ni substrate under thermal gradient: Experiments and theoretical calculations
Published 2025-03-01“…With the rapid development of the third-generation semiconductor power device towards high density, high performance, miniaturization and high temperature resistance, it is now urgent to develop a transient liquid phase diffusion (TLPD) bonding method with short bonding time and high reliability. …”
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