Editorial for the Special Issue on Micromachined Acoustic Transducers for Audio-Frequency Range by Libor Rufer, Shubham Shubham, Haoran Wang, Tom Miller, Petr Honzík, Vittorio Ferrari

“…Microelectromechanical systems (MEMS) refer to miniaturized mechanical and electro-mechanical elements that are fabricated through microelectronic processes [...]…”
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Crystal structure modulating performances for 213-nm GeO2 solar-blind photodetectors via DC reactive magnetron sputtering method by Chengming Wei, Jiabao Liu, Xinru Lan, Cheng Yang, Shuiping Huang, Dongdong Meng, Zhengwei Chen, Hongguang Duan, Xu Wang

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Fabrication of Ni-Mn Microprobe Structure with Low Internal Stress and High Hardness by Employing DC Electrodeposition by Kuan-Hui Cheng, Fu-Je Chen, Chun-Ying Lee, Chao-Sung Lin, Jung-Tang Huang, Chang-Cheng Lan, Ping-Huan Tsou, Tzu-I Ho

“…The fabrication of testing probes at 1 A/dm2 was shown to satisfy the high hardness, low internal stress, reasonable fatigue life, and nonsticking requirements for this microelectronic application.…”
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A New Junction Parameters Determination Using the Double Exponential Model by S. Dib, A. Khoury, F. PéLanchon, P. Mialhe

“…A double exponential model is used to characterize the junction properties of microelectronic devices. A method is developed to extract the physical junction parameters from the current-voltage characteristics. …”
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Coal gasification slag-derived hydrocalumite nanofluids for flow boiling heat transfer enhancement of power electronic devices by Junjie Wu, Junsheng Hou, Li Ma, Lei Huang, Zihan Ding, Hao Zhang, Baiqi Tian, Wenjing Zhou, Zhenzhen Chen, Nanjing Hao

“…This study not only presents a novel method for high-value utilization of CGS but also introduces a potential approach for thermal management enhancement of microelectronic devices.…”
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Design and Implementation of Nanotechnology QCA Geometric Greedy Router by Lamjed Touil, Ismail Gassoumi, Abdellatif Mtibaa

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Protocomputing Architecture over a Digital Medium Aiming at Real-Time Video Processing by Aoi Tanibata, Alexandre Schmid, Shinya Takamaeda-Yamazaki, Masayuki Ikebe, Masato Motomura, Tetsuya Asai

“…A protocomputational architecture is presented that implements the ancient reaction-diffusion model as a microelectronic hardware. A digital medium is selected for the physical mapping of the protoarchitecture as a way to benefit from reliable advanced integrated circuits fabrication technologies. …”
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On Oscillations and Noise in Multicomponent Adsorption: The Nature of Multiple Stationary States by Olga M. Jakšić, Zoran Jakšić, Milena B. Rašljić, Ljiljana Z. Kolar-Anić

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Passive On-Chip Components for Fully Integrated Silicon RF VCOs by Aristides Kyranas, Yannis Papananos

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A Hardware Efficient Random Number Generator for Nonuniform Distributions with Arbitrary Precision by Christian de Schryver, Daniel Schmidt, Norbert Wehn, Elke Korn, Henning Marxen, Anton Kostiuk, Ralf Korn

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Experimental Examination of an Axial Compressor as a Basis for an Active Stall Avoidance System by Richard Schulze, Dietmar K. Hennecke, Thuyen Le, Manfred Glesner

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A comparative study between E‐neurons mathematical model and circuit model by M. Daliri, Pietro M. Ferreira, G. Klisnick, A. Benlarbi‐Delai

“…This comparative study of the circuit model and a neuron mathematical model provides a quantitative understanding of the challenges between mathematical models and microelectronic circuit design criteria.…”
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An Investigation into Soft Error Detection Efficiency at Operating System Level by Seyyed Amir Asghari, Okyay Kaynak, Hassan Taheri

“…The most important of these is radiation that gives rise to permanent and transient errors on microelectronic components. The occurrence rate of transient errors is significantly more than permanent errors. …”
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A Decentralised Task Mapping Approach for Homogeneous Multiprocessor Network-On-Chips by Peter Zipf, Gilles Sassatelli, Nurten Utlu, Nicolas Saint-Jean, Pascal Benoit, Manfred Glesner

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Processing and Performance of Polymeric Transparent Conductive Composites by Parul Jain, Ranjani Muralidharan, Jennifer Sedloff, Xiao Li, Norma A. Alcantar, Julie P. Harmon

“…Recent advances in microelectronic and optoelectronic industries have spurred interest in the development of reticulate doped polymer films containing “metallic” charge transfer complexes. …”
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Photothermal Laser Printing of Sub‐Micrometer Crystalline ZnO Structures by Matthias Steurer, Paul Somers, Kristian Kraft, Lukas Grünewald, Steven Kraus, Florian Feist, Bastian Weinert, Erich Müller, Stefanie Dehnen, Claus Feldmann, Yolita M. Eggeler, Christopher Barner‐Kowollik, Martin Wegener

“…Nevertheless, sub‐micrometer ZnO structures for functional microelectronic devices have recently been laser‐printed. …”
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Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling by Ramiro Sebastian Vargas Cruz, Viktor Gonda

“…In advanced microelectronic packaging, high thermo-mechanical loads arise on the solder interconnects. …”
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Crystallite size and phase purity in Pb1-xSrxTiO3 ferroelectric perovskites for biomedical applications via controlled sintering by Rahmat Doni Widodo, Samsudin Anis, Deni Fajar Fitriyana, Maykel Manawan, Joni Sah, Aji Santiko, Rizalman Bin Mamat, Abdulfatah Abdu Yusuf, Muhammad Imam Ammarullah

“…These findings emphasize the critical role of sintering temperature in tailoring PST’s properties, enhancing its suitability for electronic and microelectronic biomedical devices. Controlled sintering in perovskite materials opens new pathways for their application in medical diagnostics and therapeutic technologies.…”
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Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages by Hao-Lin Yen, Fang-I Lai

“…This study explores the impact of copper clip design on the thermal performance of driver MOSFET (Dr.MOS) packages with the goal of optimizing heat dissipation efficiency in microelectronic components. The study examines four key variables: clip thickness, material, attachment material, and plating material. …”
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Structure of Silicon Wafers Planar Surface before and after Rapid Thermal Treatment by U. A. Pilipenko, A. A. Sergeichik, D. V. Shestovski, V. A. Solodukha

“…Presently it is important to remove mechanically disturbed layer on wafer surface during creation of up-to-date microelectronic products. Rapid thermal treatment with optical pulses of second duration is one of the applicable methods for removing disturbances in crystal lattice emerging after ion implantation. …”
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