Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates by Soares D., Vilarinho C., Barbosa J., Samuel F., Trigo L., Bré P.

Subjects: “…lead free…”
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Size-dependent thermodynamic description of the binary Pb-Sn system by Gierlotka W.

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A new thermodynamic description of the binary Sb-Zn system by Gierlotka W.

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Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys by Kopyto M., Garzel G., Zabdyr L.A.

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Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys by Garzel G., Kopyto M., Zabdyr L.A.

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THEORETICAL STUDIES ON THE MAGNETIC, ELECTRICAL, AND OPTICAL PROPERTIES OF LEAD-FREE FERROELECTRIC Ba(Zr\(_{0.2}\)Ti\(_{0.8}\)O\(_3\))  MATERIALS WITH MANGANESE DOPING by Tien Lam Vu, Hoang Thoan Nguyen, Huu Lam Nguyen, Ngoc Trung Nguyen, Quoc Van Duong, Duc Dung Dang

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COST531 project: Study of the advanced materials for lead free soldering by Kroupa A., Dinsdale A.T., Watson A., Vrestal J., Zemanova A.

Subjects: “…lead-free solders…”
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Ultra-low strain hysteresis in BaTiO3-based piezoelectric multilayer actuators via microstructural texture engineering by Yingchun Liu, Hongjun Zhang, Wenming Shi, Kai Li, Bin Yang, Wenwu Cao, Jiubin Tan

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Fabrication of droplet based triboelectric nanogenerators (DB-TENGs) using lead free KNN-PVDF nanocomposite by Babita Sharma, Reema Gupta, Anjali Sharma, Arijit Chowdhuri, Monika Tomar

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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

Subjects: “…lead-free solders…”
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Phase relations near ternary eutectic point in the Ag-In-Sb system by Jendrzejczyk-Handzlik D., Živković Dragana, Gierlotka W., Manasijević D., Fitzner K., Minić D.

Subjects: “…lead-free solders…”
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Unique Optoelectronic Properties and Applications of Lead‐Free Perovskites and Derivatives by Mingbian Li, Weijun Li, Haotong Wei

Subjects: “…lead‐free perovskites…”
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Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Effect of additive elements Bi/Ni/Ge on crack initiation and propagation for low-Ag solders by Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

Subjects: “…Lead-free solder…”
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Ternary invariant point at 374°C in the three phase region AlSb-Al-Zn inside the Al-Sb-Zn ternary system by Klančnik G., Medved J.

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A Broad‐High Temperature Ceramic Capacitor with Local Polymorphic Heterogeneous Structures by Binglong Zheng, Ying Lin, Haibo Yang, Hongmei Jing, Hu Nan, Yifei Wang, Fang‐Zhou Yao, Minquan Wang, Qibin Yuan

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Investigating temperature effects on perovskite solar cell performance via SCAPS-1D and impedance spectroscopy by A. Mortadi, Y. Tabbai, E. El Hafidi, H. Nasrellah, E. Chahid, M. Monkade, R. El Moznine

Subjects: “…Lead free perovskite solar cells…”
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Advancements in eco-friendly lead-free perovskite/Sb2Se3 tandem solar cells: TCAD simulations by Tarek I. Alanazi, Ahmed Shaker, Dalia Selim, Mohamed Okil

Subjects: “…Lead-Free Perovskite…”
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Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys by Sklyarchuk V., Plevachuka Yu., Kaban I., Novakovic R.

Subjects: “…lead-free solders…”
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