Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips by Xunyu Li, Zijin Pan, Weiquan Hao, Runyu Miao, Zijian Yue, Albert Wang

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Integrated optoelectronics with two-dimensional materials by Cheng Zhenzhou, Guo Rongxiang, Wang Jiaqi, Wang Yi, Xing Zhengkun, Ma Lei, Wei Wei, Yu Yu, Tsang Hon Ki, Liu Tiegen

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Heterogeneous Integrated III-V-on-SOI Photodetector Using Micro-transfer Printing Method by WANG Zhaocong, QUAN Zhiheng, ZHENG ShiGuanqing, ZHU Yan, YE Nan, LU Liangjun, ZHOU Linjie, SONG Yingxiong

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Simultaneous Bidirectional Signaling for Die-to-Die Links: Signal Integrity Challenges and Hybrid Circuits by Durand Jarrett-Amor, Tony Chan Carusone

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Heterogeneous Integration Technologies for Artificial Intelligence Applications by Madison Manley, Ashita Victor, Hyunggyu Park, Ankit Kaul, Mohanalingam Kathaperumal, Muhannad S. Bakir

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Gallium oxide (Ga2O3) heterogeneous and heterojunction power devices by Bochang Li, Yibo Wang, Zhengdong Luo, Wenhui Xu, Hehe Gong, Tiangui You, Xin Ou, Jiandong Ye, Yue Hao, Genquan Han

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Heterogeneous and hybrid integration for Brillouin microwave photonics by Choon Kong Lai, Moritz Merklein, Alvaro Casas Bedoya, Benjamin J. Eggleton

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A methodical approach to design adiabatic waveguide couplers for heterogeneous integrated photonics by Jef Van Asch, Ahmed Kandeel, Junwen He, Jeroen Missinne, Peter Bienstman, Dries Van Thourhout, Geert Van Steenberge, Joris Van Campenhout

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PowerSynth 2: Automated Power Electronics Physical Design Synthesis With Custom and Heterogeneous Components by Mehran Sanjabiasasi, H. Alan Mantooth, Yarui Peng

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Enhanced thermal dissipation for BCB-bonded 3D integrated membrane photonic circuits by Salim Abdi, Kevin Williams, Yuqing Jiao

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A Heterogeneously Integrated 256-Element 5G Phased Array: Design, Assembly, Test by Bodhisatwa Sadhu, Arun Paidimarri, Atom O. Watanabe, Duixian Liu, Xiaoxiong Gu, Christian W. Baks, Yujiro Tojo, Yoshiharu Fujisaku, Isabel De Sousa, Yo Yamaguichi, Ning Guan, Alberto Valdes-Garcia

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Frequency-comb-referenced multiwavelength interferometry for high-precision and high-speed 3D measurement in heterogeneous semiconductor packaging by Park Jun Hyung, Kim Dae Hee, Chu Huy Hoang, Hahm Ji Won, Kang Guseon, Lee Dongil, Song Seyong, Kang Mingu, Kim Seung-Woo, Kim Young-Jin

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Emerging Copper-to-Copper Bonding Techniques: Enabling High-Density Interconnects for Heterogeneous Integration by Wenhan Bao, Jieqiong Zhang, Hei Wong, Jun Liu, Weidong Li

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Wide‐Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction by Amun Jarzembski, Siddharth Nair, Wyatt Hodges, Matthew Jordan, Anthony McDonald, Logan Antiporda, Greg W. Pickrell, Timothy Walsh, Fabio Semperlotti, Jason Neely, Luke Yates

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Survey on generalized safety and security technology for system on wafer by LI Peijie, GUO Wei, SHEN Jianliang, CAO Zhipeng, MEI Bo

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A Pathway for the Integration of Novel Ferroelectric Thin Films on Non-Planar Photonic Integrated Circuits by Enes Lievens, Kobe De Geest, Ewout Picavet, Liesbet Van Landschoot, Henk Vrielinck, Gilles Freddy Feutmba, Hannes Rijckaert, Klaartje De Buysser, Dries Van Thourhout, Peter Bienstman, Jeroen Beeckman

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Residual stress and deformation analysis considering adhesive material properties to enhance manufacturing of HBM by Jaejin Jeon, Jeonghoon Song, Jun Young Oh, Seok Hwan Lee, Younghun Kim, Yun Ho Kim, Sam-Jong Choi, Sang Won Yoon

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Approaches to Heterogeneous Integration for Millimeter-Wave Applications by A. S. Efimov

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Misalignment in Mechanical Interlocking Heterogeneous Integration: Emergent Behavior and Geometry Optimization by Matthew Nakamura, Corrisa Heyes, Ethan Rocheville, Kirsten Peterson, Joseph J. Brown

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Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates by Ruggero Loi, James O'Callaghan, Brendan Roycroft, Cedric Robert, Alin Fecioru, Antonio Jose Trindade, Agnieszka Gocalinska, Emanuele Pelucchi, Christopher A. Bower, Brian Corbett

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