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    A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration

    A novel SS/Cu composite with bioinspired helical-lamellar-interpenetrated structure by direct ink writing and pressureless infiltration by Likai Yang, Bin Yuan, Junchi Cen, Jinhua He, Qiaoli Lin, Yu Shi

    Published 2025-01-01
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