Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits by Peng Xu, Huan Huang, Songjie Zhao, Xiushan Liu, Fa Zou, Chao Li, Jun Ai, Hui Liu

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Investigation of turbulent thermal-hydraulic behaviors of a heat exchanger tube with U-cut twisted-tape by K. Wongcharee, V. Chuwattanakul, S. Chamoli, N. Maruyama, M. Hirota, S. Eiamsa-ard

Subjects: “…Heat transfer performance…”
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