The Cu–Sn multilevel gradient heterogeneous interface interpenetrative growth mechanism and its regulation strategies by Yulu Ouyang, Yahui Liu, Guoshang Zhang, Tao Huang, Weiwei Lu, Dong Liu, Aikui Liu, Kexing Song

Subjects: “…Cu–Sn…”
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Dual-stage corrosion mechanisms and antibacterial enhancement of Cu-Sn-P alloys with Si and Al microalloying in simulated body fluid by Lin Su, Wenbin Liu, Yangfan Liu, Yanbin Jiang, Yanggang Wang, Zhou Li, Kaiyu You, ChuYu Wang, Gengyan Liu

Subjects: “…Cu-Sn alloy…”
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Interactions of Cu-substrates with titanium-alloyed Sn-Zn solders by Soares D., Barbosa J., Vilarinho C.

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Investigation of mechanicaland structural characteristics of some alloys in Ag-rich corner of Ag-Cu-Sn system by Marjanović S., Gusković D., Trucić M., Marjanović B.

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Control of peritectic phase content and its effect on properties of CuSn20P1 alloy by semi-solid rheological forming by Hao Zhang, Yongkun Li, Rongfeng Zhou, Dingdong Huo, Yao Li, Lei Wang

Subjects: “…CuSn20P1 alloy…”
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