-
201
Design of Shadow Filter Using Low-Voltage Multiple-Input Operational Transconductance Amplifiers
Published 2025-01-01“…The OTA and shadow filters were designed and simulated using a 0.18 µm CMOS process to validate the functionality and performance of the proposed circuits.…”
Get full text
Article -
202
Design of Modular Power Management and Attitude Control Subsystems for a Microsatellite
Published 2018-01-01“…Latch-up protection systems have been designed and analyzed for CMOS-based COTS components, in order to make them suitable for space radioactive environment. …”
Get full text
Article -
203
Source-independent quantum random number generators with integrated silicon photonics
Published 2025-01-01“…Silicon photonics demonstrates significant promise for QRNG due to its benefits in miniaturization, cost-effective device manufacturing, and compatibility with CMOS microelectronics. This study experimentally demonstrates a silicon-based discrete variable SI-QRNG. …”
Get full text
Article -
204
A 10 GHz Dual-Loop PLL With Active Cycle-Jitter Correction Achieving 12dB Spur and 29% Jitter Reduction
Published 2024-01-01“…An experimental prototype has been fabricated in a TSMC 40 nm CMOS process. By activating the ACJC, the spurious tones can be reduced by 12 dB when a 260MHz disturbance is injected without resort to sophisticated calibration. …”
Get full text
Article -
205
Cosimulation of Power and Temperature Models at the SystemC/TLM for a Soft-Core Processor
Published 2020-01-01“…On one hand, today, due to the limited power budget imposed by the batteries, power is the limiting factor of the logic CMOS. On the other hand, the downscaling of the technology node for 65 nm and beyond, based on the International Technology Roadmap for Semiconductors (ITRS) as a reference, has not only resulted in huge energy consumption but also increased the temperature chip. …”
Get full text
Article -
206
A High-Speed and Low-Offset Dynamic Latch Comparator
Published 2014-01-01“…The Monte-Carlo simulation results for the designed comparator in 0.18 μm CMOS process show that the equivalent input-referred offset voltage is 720 μV with 3.44 mV standard deviation. …”
Get full text
Article -
207
A four‐stage yield optimization technique for analog integrated circuits using optimal computing budget allocation and evolutionary algorithms
Published 2022-09-01“…The yield value obtained from the simulation results for two‐stage class‐AB Operational Transconductance Amplifer (OTA) in 180 nm Complementary Metal‐Oxide‐Semiconductor (CMOS) technology is 99.85%. The proposed method has less computational effort and high accuracy than the MC‐based approaches. …”
Get full text
Article -
208
The Effect of Ferroelectric/Dielectric Capacitance Ratio on Short-Term Retention Characteristics of MFMIS FeFET
Published 2024-01-01“…This is primarily due to their compatibility with CMOS technology and reliable switching characteristics. …”
Get full text
Article -
209
SAR-Assisted Energy-Efficient Hybrid ADCs
Published 2024-01-01“…The distinct advantages of low power consumption and hardware compactness make SAR ADCs especially appealing in scaled CMOS technologies, garnering significant attention. …”
Get full text
Article -
210
A Novel Compact Wideband Bandpass Filter With High Upper Stopband Rejection
Published 2025-01-01“…The proposed BPF is fabricated in 65 nm CMOS technology with a core area of 0.072 mm<sup>2</sup> (7.1×10<sup>-3</sup> λ<sub>0</sub><sup>2</sup>). …”
Get full text
Article -
211
Scaling Logic Area With Multitier Standard Cells
Published 2024-01-01“…While the footprint of digital complementary metal-oxide–semiconductor (CMOS) circuits has continued to decrease over the years, physical limitations for further intralayer geometric scaling become apparent. …”
Get full text
Article -
212
Design Techniques for Single-Ended Wireline Crosstalk Cancellation Receiver Up To 112 Gb/s
Published 2024-01-01“…This article introduces several techniques that enable single-ended crosstalk cancellation receivers to achieve data rates of up to 56 and 112 Gb/s per lane using four-level pulse amplitude modulation (PAM-4) in 28-nm CMOS technology. These 56 and 112 Gb/s receivers achieve a bit error rate of <<inline-formula> <tex-math notation="LaTeX">$10{^{-}10 }$ </tex-math></inline-formula> and <<inline-formula> <tex-math notation="LaTeX">$10{^{-}12 }$ </tex-math></inline-formula> with a single-ended channel loss of 24 and 25 dB, respectively.…”
Get full text
Article -
213
Design of a Novel W-Sinker RF LDMOS
Published 2015-01-01“…Combined with the adoption of the techniques, like grounded shield, step gate oxide, LDD optimization, and so forth, an advanced technology for RF LDMOS based on conventional 0.35 μm CMOS technology is well established. An F+A power amplifier product with frequency range of 1.8–2.1 GHz is developed for the application of 4G LTE base station and industry leading performance is achieved. …”
Get full text
Article -
214
Chiral exceptional point enhanced active tuning and nonreciprocity in micro-resonators
Published 2025-01-01“…Our results indicate asymmetric electro-optic modulation with up to 17 dB contrast at GHz and CMOS-compatible voltage levels. Such wafer-scale nano-manufacturing of chiral electro-optic modulators and the chiral EP-tailored tunning may facilitate new micro-resonator functionalities in quantum information processing, electromagnetic wave control, and optical interconnects.…”
Get full text
Article -
215
RSFQ All-Digital Programmable Multitone Generator for Quantum Applications
Published 2025-01-01“…Rapid single flux quantum (RSFQ) technology is at the forefront of replacing current standard CMOS-based control architectures for a number of applications, including quantum computing and quantum sensor arrays. …”
Get full text
Article -
216
Ferroelectric memory: state-of-the-art manufacturing and research
Published 2020-10-01“…The leading FRAM technology remains the 130 nm node CMOS process developed at Texas Instruments fabs. …”
Get full text
Article -
217
A Modified Implementation of Tristate Inverter Based Static Master-Slave Flip-Flop with Improved Power-Delay-Area Product
Published 2014-01-01“…HSPICE simulations were used to characterize the transient response of the flip-flop designs in a 180 nm/1.8 V CMOS technology. Simulations were also performed at 130 nm, 90 nm, and 65 nm to reveal the scalability of both the designs at modern process nodes.…”
Get full text
Article -
218
Hardware Efficient Speech Enhancement With Noise Aware Multi-Target Deep Learning
Published 2024-01-01“…Mapping the design on a 65-nm CMOS process led to a chip core area of <inline-formula> <tex-math notation="LaTeX">$3.88~mm^{2}$ </tex-math></inline-formula> and a power consumption of 1.91 mW when operating at a 10 MHz clock frequency.…”
Get full text
Article -
219
Design and Analysis of a Blocker-Tolerant Gain-Boosted N-Path Receiver Using a Bottom-Plate Switched-Capacitor Technique
Published 2024-01-01“…Besides that, a clock-delay technique is proposed to improve the LO non-overlap characteristics. Designed in 65-nm CMOS, the simulated results present that under an 80-MHz offset frequency, the RX scores a 29 dBm OOB-IIP3 and a -2.3 dBm B-1dB. …”
Get full text
Article -
220
Bottom-up fabrication of 2D Rydberg exciton arrays in cuprous oxide
Published 2025-01-01“…To harness these nonlinearities for quantum applications, the confinement dimensions must match the Rydberg blockade size, which can reach several microns in Cu2O. Using a CMOS-compatible growth technique, this study demonstrates the bottom-up fabrication of site-selective arrays of Cu2O microparticles. …”
Get full text
Article