-
1
Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation
Published 2025-01-01Subjects: Get full text
Article -
2
AgIn2 thickness on void rate, microstructure, IMC growth, thermal and mechanical properties of fluxless In@AgIn2 joint
Published 2025-03-01Subjects: Get full text
Article