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  1. 1
    Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation

    Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation by Yuezong Zheng, Junchen Liu, Hongchao Ji, Xiaomin Huang, Wenchao Xiao, Abdullah Aziz Saad

    Published 2025-01-01
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  2. 2
    AgIn2 thickness on void rate, microstructure, IMC growth, thermal and mechanical properties of fluxless In@AgIn2 joint

    AgIn2 thickness on void rate, microstructure, IMC growth, thermal and mechanical properties of fluxless In@AgIn2 joint by Jing Wen, Guoliao Sun, Jinyang Su, Yi Fan, Linzheng Fu, Zhuo Chen, Wenhui Zhu

    Published 2025-03-01
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