Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures by Nicola Frasson, Marco Galiazzo

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Behavior of tellurium during vacuum thermal decomposition of Ag–Cu–Te alloy by Jia Deng, Hongjun Ding, Huan Luo, Xianjun Lei, Baoqiang Xu, Bin Yang

Subjects: “…Ag–Cu–Te alloy…”
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Electrochemical behavior of AgCu50 in alkaline media in the presence of chlorides and 2-mercaptobenzothiazole by Grekulović V., Rajčić-Vujasinović M., Mitovski A.

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Investigation of mechanicaland structural characteristics of some alloys in Ag-rich corner of Ag-Cu-Sn system by Marjanović S., Gusković D., Trucić M., Marjanović B.

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Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer by Hongjian Wu, Ya’nan Zhang, Qingjian Jia, Hui Cao, Han Li, Ming Ma

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Synthesis and characterization of innovative GA@Ag-CuO nanocomposite with potent antimicrobial and anticancer properties by Amr H. Hashem, Mostafa A. Abdel-Maksoud, Sabiha Fatima, Saeedah M. Almutairi, Mohamed A. Ghorab, Ahmed I. El-Batal, Gharieb S. El-Sayyad

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Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue by Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang

Subjects: “…Sn-Ag-Cu solder…”
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Interdiffusion coefficient and atomic mobility for fcc Ag-Cu-Mg phase at 1073 K by Du C.-B., Huang S.-P., Min Q.-H., Liu Y.-L., Wen S.-Y.

Subjects: “…fcc ag-cu-mg…”
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High-performance electrochemical sensor based on Pt-Ag@Cu-BDC MOF composite modified glassy carbon electrode for detection of imidacloprid in citrus juice and water samples by Fariba Hasani, Jahan Bakhsh Raoof, Reza Ojani, Milad Ghani

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Plasma-polymerized fluorocarbon Ag–Cu nanocomposites: Nanostructure optimization for superior SERS sensitivity by Joonhyuk Lee, Sung Hyun Kim, Seok-Kyun Son, Sang-Jin Lee

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