Showing 141 - 160 results of 262 for search '"APEC"', query time: 0.05s Refine Results
  1. 141
    High Voltage Ceramic Capacitors

    High Voltage Ceramic Capacitors by D. A. Nicker

    Published 1974-01-01
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  2. 142
    The Use of Niobium as an Anode Material in Liquid Filled Electrolytic Capacitors

    The Use of Niobium as an Anode Material in Liquid Filled Electrolytic Capacitors by J. C. Hendy, N. F. Jackson

    Published 1974-01-01
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  3. 143
    Electrical Contacts to Evaporated Cadmium Selenide

    Electrical Contacts to Evaporated Cadmium Selenide by G. de Mey

    Published 1974-01-01
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  4. 144
    Optimisation of Thin and Thick Film Technology for Hybrid Microwave Circuits

    Optimisation of Thin and Thick Film Technology for Hybrid Microwave Circuits by Werner Wiesbeck, Bernhard Rembold, Holger Meinel

    Published 1977-01-01
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  5. 145
    Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

    Reliability Considerations of Flip Chip Components for Automotive Electronic Applications by Iwao Tachikawa, Naoharu Tsuzimoto, Isao Bansaku, Keisuke Sugiyama

    Published 1981-01-01
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  6. 146
    A Hybrid Thin-Film Logic Circuit Using Gallium Arsenide Field Effect Transistors

    A Hybrid Thin-Film Logic Circuit Using Gallium Arsenide Field Effect Transistors by A. C. Cross, R. A. Startin

    Published 1978-01-01
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  7. 147
    On the Sensitivity of Canonically Extended RC-Active Multiloop Filters

    On the Sensitivity of Canonically Extended RC-Active Multiloop Filters by R. E. Massara

    Published 1980-01-01
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  8. 148
    Courses in Microelectronics at the Technical University, Budapest

    Courses in Microelectronics at the Technical University, Budapest by K. Tarnay, A. Ambrózy

    Published 1982-01-01
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  9. 149
    Time Dependence of Ion-Migration Effects in NiCr Resistor Films

    Time Dependence of Ion-Migration Effects in NiCr Resistor Films by R. Hoffmann, U. Smith

    Published 1978-01-01
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  10. 150
    Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials

    Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials by R. V. Allen

    Published 1983-01-01
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  11. 151
    Size and Grain-Boundary Effects in the Electrical Conductivity of Thin Monocrystalline Films

    Size and Grain-Boundary Effects in the Electrical Conductivity of Thin Monocrystalline Films by C. R. Tellier

    Published 1978-01-01
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  12. 152
    Computer Aided Design of Hybrid Circuits

    Computer Aided Design of Hybrid Circuits by L. Piana, F. Francese, T. Cagnin, G. P. Ferraris

    Published 1983-01-01
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  13. 153
    High Density Packaging Technology

    High Density Packaging Technology by Kazuo Mizuno, Yusaku Nishi

    Published 1981-01-01
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  14. 154
    D.C. Sputtering Process: Its Characterization and its Problems When Applied to Tin-Dioxide Thin-Films

    D.C. Sputtering Process: Its Characterization and its Problems When Applied to Tin-Dioxide Thin-Films by Anant G. Sabnis

    Published 1980-01-01
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  15. 155
    An Evaluation of the Voltage-Current Rating Characteristics of Miniature Monolithic RF Ceramic Capacitors

    An Evaluation of the Voltage-Current Rating Characteristics of Miniature Monolithic RF Ceramic Capacitors by M. J. Albert

    Published 1978-01-01
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  16. 156
    Effect of Heat Treatment of Anodic Oxide Films on Aluminium on Their Photoluminescent Properties

    Effect of Heat Treatment of Anodic Oxide Films on Aluminium on Their Photoluminescent Properties by H. Sakai, N. Baba, K. Shimizu, S. Tajima

    Published 1976-01-01
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  17. 157
    Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards

    Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards by J. Pinkola, I. Hajdu, P. Banlaki, E. Toth

    Published 1984-01-01
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  18. 158
    Active Trimming of Hybrid Integrated Circuits

    Active Trimming of Hybrid Integrated Circuits by P. Krémer, P. Németh

    Published 1984-01-01
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  19. 159
    Multi-Chip Module Technology

    Multi-Chip Module Technology by D. R. Barbour, R. A. Rinne

    Published 1982-01-01
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  20. 160
    The Effect of Microelectronics on the National Telephone Network in Hungary

    The Effect of Microelectronics on the National Telephone Network in Hungary by István Házman

    Published 1982-01-01
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