Processing Considerations of Thick Film Devices With Multilayered Resistors by Akira Ikegami, Nobuyuki Sugishita, Tsuneo Endo

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Hybrid Electronic Watt-Hour Meter by M. Hrovat, F. Jan, L. Trontelj, J. Trontelj

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Principe d'un Analyseur de Spectre Optique Utilisant les Couches Minces Pulverisees by H. Murray

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Announcement

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Design of Wide Band Amplifiers Using Hybrid Integrated Techniques by Aurel Sonkoly

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New Thick Film Functional Devices by M. Haradome, O. Abe, Y. Taketa

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Silicon and Hybrid Micro-Electronic Sensors by G. K. Steenvoorden, D. J. W. Noorlag, S. Middelhoek

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Wire Wrapped Joints—A Review by P. M. A. Sollars

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Gold-Aluminium Intermetallic Compound Formation by C. Nobili, G. Majni, E. Galli, G. Ottaviani

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A Short Communication — Determination of Chip and Substrate Temperatures by M. R. Haskard

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Electrical Behaviour of Langmuir Films: A Review, Part I by V. K. Agarwal

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Epoxies for Component Mounting in Thick Film Hybrids by C. Marshall

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Reliability Assessment and Screening by Reliability Indicator Methods by Jørgen Møltoft

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Adequate Use of the Cottey Model for the Description of Conduction in Polycrystalline Films by A. J. Tosser, C. R. Tellier

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A ZnTe Thin Film Memory Device by Marc Burgelman

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Characterization of Thick Film Capicitors by M. Vernet, M. Descamps, Y. Leroy

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Conference Diary

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Thick Film Thermal Print Heads by Peter Barnwell

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The Influence of the Area of a Thin Film Capacitor on the Breakdown Voltage by T. Berlicki

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AVI Transponder by Johji Sakuragi, Yoshinori Kimura, Shoichi Kamata

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