Density Upgrading in Tape Automated Bonding by G. Dehaine, K. Kurzweil

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Field and Circuit Models for the Wound Foil Inductor by P. N. Murgatroyd

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Heat Dissipation and Ripple Current Rating in Electrolytic Capacitors by F. G. Hayatee

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The Production of Complex Thin Film Circuits by V. Needham

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Research and Development in the Field of Passive Components by D. S. Campbell

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Electrical Properties of Epitaxial Aluminium Films by F. Warkusz, E. Dobierzewska-Mozrzymas

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Investigation of the Dissipation Process in Electrolytic Capacitors by Keith A. Joyner, Leconte Cathey

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Active Filters and Hybrid Technology by P. L. Moran

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Electrical Conduction by Percolation in Thick Film Resistors by M. Prudenziati, F. Forlani

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Failure Mechanism of Solid Tantalum Capacitors by F. J. J. Driesens, B. Goudswaard

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Selective Glaze for Last Line Visible Thermal Head by Minoru Terashima, Nobuo Kamehara, Kaoru Hashimoto, Koichi Niwa

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Tape Automated Bonding for High Density Packaging by Karel Kurzweil

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Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads by R. Kato, Y. Hiki, T. Tsuge, M. Nitta

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Silver-Ruthenium Dioxide Contacts by D. J. Pedder

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Improvements in Multilayer Ceramic Capacitors by A. F. Dyson

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Indirect Heating Source for Treatment of Malignant Brain Tumours by Robert G. Selker, Sidney K. Wolfson, Philip C. Thackray, Zvi H. Meiksin

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The Problems of Selecting a Proper Microlithographic Imaging System by L. D. Ugray

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New Crossovers Using a Combined Film Technique by Günter Kiessling

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The Oxide-Forming Role of Water in Aluminum Electrolytic Capacitors by Steven M. Florio, Walter J. Bernard

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Conference Report by D. S. Campbell

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