Investigation the CMP process of 6 H-SiC in H2O2 solution with ReaxFF molecular dynamics simulation by Yanzhang Gu, Kaiping Feng, Lanxing Xu, Liang Zhao, Tianchen Zhao, Binghai Lyu

Subjects: “…6H-SiC wafer…”
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Influence of initial surface roughness on the deposition and adhesion of electroless Ni-P plating on 6H-SiC substrate by Hossein Ahmadian, Tianfeng Zhou, Weijia Guo, Qian Yu, A.M. Sadoun, A. Fathy, Yang Xuanzhe, M. Elmahdy

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