Showing 1 - 2 results of 2 for search '"3D-IC"', query time: 0.02s Refine Results
  1. 1
    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions by Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai

    Published 2024-01-01
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  2. 2
    Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits

    Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits by Peng Xu, Huan Huang, Songjie Zhao, Xiushan Liu, Fa Zou, Chao Li, Jun Ai, Hui Liu

    Published 2025-02-01
    Subjects: “…3-D ICs…”
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