Showing 1 - 3 results of 3 for search '"3D-IC"', query time: 0.03s Refine Results
  1. 1
    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

    High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions by Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai

    Published 2024-01-01
    Subjects:
    Get full text
    Article
    Save to List
    Saved in:
  2. 2
    Toward Fine-Grained Partitioning of Low-Level SRAM Caches for Emerging 3D-IC Designs

    Toward Fine-Grained Partitioning of Low-Level SRAM Caches for Emerging 3D-IC Designs by Sudipta Das, Bhawana Kumari, Siva Satyendra Sahoo, Yukai Chen, James Myers, Dragomir Milojevic, Dwaipayan Biswas, Julien Ryckaert

    Published 2024-01-01
    Subjects: “…3-D integrated circuit (3D-IC)…”
    Get full text
    Article
    Save to List
    Saved in:
  3. 3
    Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits

    Applying the carbon materials in TSVs array for enhancing heat transfer performance of three-dimensional integrated circuits by Peng Xu, Huan Huang, Songjie Zhao, Xiushan Liu, Fa Zou, Chao Li, Jun Ai, Hui Liu

    Published 2025-02-01
    Subjects: “…3-D ICs…”
    Get full text
    Article
    Save to List
    Saved in:

Search Tools: