Scaling Logic Area With Multitier Standard Cells by Florian Freye, Christian Lanius, Hossein Hashemi Shadmehri, Diana Gohringer, Tobias Gemmeke

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Energy-/Carbon-Aware Evaluation and Optimization of 3-D IC Architecture With Digital Compute-in-Memory Designs by Hyung Joon Byun, Udit Gupta, Jae-Sun Seo

Subjects: “…3-D integrated circuit (IC)…”
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Enhanced thermal dissipation for BCB-bonded 3D integrated membrane photonic circuits by Salim Abdi, Kevin Williams, Yuqing Jiao

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A Chisel Generator for Standardized 3-D Die-to-Die Interconnects by Harrison Liew, Farhana Sheikh, Jong-Ru Guo, Zuoguo Wu, Borivoje Nikolic

Subjects: “…3-D integrated circuits…”
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Toward Fine-Grained Partitioning of Low-Level SRAM Caches for Emerging 3D-IC Designs by Sudipta Das, Bhawana Kumari, Siva Satyendra Sahoo, Yukai Chen, James Myers, Dragomir Milojevic, Dwaipayan Biswas, Julien Ryckaert

Subjects: “…3-D integrated circuit (3D-IC)…”
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Monolithic 3-D-Based Nonvolatile Associative Processor for High-Performance Energy-Efficient Computations by Esteban Garzon, Alessandro Bedoya, Marco Lanuzza, Leonid Yavits

Subjects: “…3-D integration…”
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3D Crystal Construction by Single‐Crystal 2D Material Supercell Multiplying by Wenhao Li, Jichuang Shen, Yaqing Ma, Xiang Xu, Han Chen, Lida Yu, Chen Ji, Menglin He, Kezhao Ma, Yiwei Duo, Li Wang, Tongbo Wei, Liping Shi, Muhong Wu, Kaihui Liu, Huaze Zhu, Wei Kong

Subjects: “…2D/3D integration…”
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