Monodisperse SiO<sub>2</sub> Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing
The atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface. In this study, an efficient and controllable Stöber approach was develop...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Nanomaterials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-4991/15/9/665 |
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