A simple beam model to analyse the durability of adhesively bonded tile floorings in presence of shrinkage
A simple beam model for the evaluation of tile debonding due to substrate shrinkage is presented. The tile-adhesive-substrate package is modeled as an Euler-Bernoulli beam laying on a two-layer elastic foundation. An effective discrete model for inter-tile grouting is introduced with the aim of mode...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Gruppo Italiano Frattura
2014-07-01
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| Series: | Fracture and Structural Integrity |
| Subjects: | |
| Online Access: | https://www.fracturae.com/index.php/fis/article/view/1261 |
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| Summary: | A simple beam model for the evaluation of tile debonding due to substrate shrinkage is presented. The tile-adhesive-substrate package is modeled as an Euler-Bernoulli beam laying on a two-layer elastic foundation. An effective discrete model for inter-tile grouting is introduced with the aim of modelling workmanship defects due to partial filled groutings. The model is validated using the results of a 2D FE model. Different defect configurations and adhesive typologies are analysed, focusing the attention on the prediction of normal stresses in the adhesive layer under the assumption of Mode I failure of the adhesive. |
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| ISSN: | 1971-8993 |