Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process
In present study, the thermo-mechanical responses of Ag alloy wire during wire bonding manufacture procedure is analyzed by the combined experimental and simulation approach. A micro-tensile test method is adopted to investigate the temperature and strain rate dependence mechanical properties of Ag...
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| Format: | Article |
| Language: | English |
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IEEE
2025-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/10843694/ |
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| author | Deshin Liu Tingsheng Chang Zhenwei Zhuang Yungching Chao Sungting Chung Peichen Huang |
| author_facet | Deshin Liu Tingsheng Chang Zhenwei Zhuang Yungching Chao Sungting Chung Peichen Huang |
| author_sort | Deshin Liu |
| collection | DOAJ |
| description | In present study, the thermo-mechanical responses of Ag alloy wire during wire bonding manufacture procedure is analyzed by the combined experimental and simulation approach. A micro-tensile test method is adopted to investigate the temperature and strain rate dependence mechanical properties of Ag alloy wire. Extracted stress-strain curves are further utilized to demonstrate the coupled thermo-mechanical response via the utilization of Johnson-Cook (J-C) constitutive model. Aforementioned constitutive model is imported into transient dynamic simulation to estimate the characteristics on wire loop formation profile and wire stress distribution. Under the different consideration of wire loop formation speed, it is found that the strain rate has significant influence on plastic strain and corresponding stress at kink region, which is interpolated by the J-C model. The critical stress/strain location and loop height of concerned wire can be effectively estimated by the present approach, and provided the design guidelines of fine Ag alloy wire in application of electronic packaging. |
| format | Article |
| id | doaj-art-fb82400cfdd74487824af4cac92e4bd3 |
| institution | Kabale University |
| issn | 2169-3536 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj-art-fb82400cfdd74487824af4cac92e4bd32025-01-25T00:01:20ZengIEEEIEEE Access2169-35362025-01-0113141771418510.1109/ACCESS.2025.353050910843694Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation ProcessDeshin Liu0Tingsheng Chang1Zhenwei Zhuang2https://orcid.org/0000-0002-7194-0599Yungching Chao3Sungting Chung4Peichen Huang5https://orcid.org/0009-0006-2176-8117Advanced Institute of Manufacturing for High-Tech Innovations, National Chung Cheng University, Chiayi, TaiwanDepartment of Mechanical Engineering, National Chung Cheng University, Chiayi, TaiwanAdvanced Institute of Manufacturing for High-Tech Innovations, National Chung Cheng University, Chiayi, TaiwanDepartment of Mechanical and Energy Engineering, National Chiayi University, Chiayi, TaiwanBusiness Integration Department, Solar Applied Materials Technology Corporation, Tainan, TaiwanAdvanced Institute of Manufacturing for High-Tech Innovations, National Chung Cheng University, Chiayi, TaiwanIn present study, the thermo-mechanical responses of Ag alloy wire during wire bonding manufacture procedure is analyzed by the combined experimental and simulation approach. A micro-tensile test method is adopted to investigate the temperature and strain rate dependence mechanical properties of Ag alloy wire. Extracted stress-strain curves are further utilized to demonstrate the coupled thermo-mechanical response via the utilization of Johnson-Cook (J-C) constitutive model. Aforementioned constitutive model is imported into transient dynamic simulation to estimate the characteristics on wire loop formation profile and wire stress distribution. Under the different consideration of wire loop formation speed, it is found that the strain rate has significant influence on plastic strain and corresponding stress at kink region, which is interpolated by the J-C model. The critical stress/strain location and loop height of concerned wire can be effectively estimated by the present approach, and provided the design guidelines of fine Ag alloy wire in application of electronic packaging.https://ieeexplore.ieee.org/document/10843694/Ag alloy wirewire bondingmicro-tensile testtemperature-dependence mechanical propertiesJohnson-Cook constitutive modeltransient dynamic simulation |
| spellingShingle | Deshin Liu Tingsheng Chang Zhenwei Zhuang Yungching Chao Sungting Chung Peichen Huang Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process IEEE Access Ag alloy wire wire bonding micro-tensile test temperature-dependence mechanical properties Johnson-Cook constitutive model transient dynamic simulation |
| title | Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process |
| title_full | Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process |
| title_fullStr | Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process |
| title_full_unstemmed | Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process |
| title_short | Manufacturing Reliability Assessment of Fine Ag Alloy Wire During Wire Loop Formation Process |
| title_sort | manufacturing reliability assessment of fine ag alloy wire during wire loop formation process |
| topic | Ag alloy wire wire bonding micro-tensile test temperature-dependence mechanical properties Johnson-Cook constitutive model transient dynamic simulation |
| url | https://ieeexplore.ieee.org/document/10843694/ |
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