Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell Applications

It is difficult to deposit extremely thin a-Si:H layer in heterojunction with intrinsic thin layer (HIT) solar cell due to thermal damage and tough process control. This study aims to understand oxide passivation mechanism of silicon surface using rapid thermal oxidation (RTO) process by examining s...

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Main Authors: Youngseok Lee, Woongkyo Oh, Vinh Ai Dao, Shahzada Qamar Hussain, Junsin Yi
Format: Article
Language:English
Published: Wiley 2012-01-01
Series:International Journal of Photoenergy
Online Access:http://dx.doi.org/10.1155/2012/753456
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author Youngseok Lee
Woongkyo Oh
Vinh Ai Dao
Shahzada Qamar Hussain
Junsin Yi
author_facet Youngseok Lee
Woongkyo Oh
Vinh Ai Dao
Shahzada Qamar Hussain
Junsin Yi
author_sort Youngseok Lee
collection DOAJ
description It is difficult to deposit extremely thin a-Si:H layer in heterojunction with intrinsic thin layer (HIT) solar cell due to thermal damage and tough process control. This study aims to understand oxide passivation mechanism of silicon surface using rapid thermal oxidation (RTO) process by examining surface effective lifetime and surface recombination velocity. The presence of thin insulating a-Si:H layer is the key to get high Voc by lowering the leakage current (I0) which improves the efficiency of HIT solar cell. The ultrathin thermal passivation silicon oxide (SiO2) layer was deposited by RTO system in the temperature range 500–950°C for 2 to 6 minutes. The thickness of the silicon oxide layer was affected by RTO annealing temperature and treatment time. The best value of surface recombination velocity was recorded for the sample treated at a temperature of 850°C for 6 minutes at O2 flow rate of 3 Lpm. A surface recombination velocity below 25 cm/s was obtained for the silicon oxide layer of 4 nm thickness. This ultrathin SiO2 layer was employed for the fabrication of HIT solar cell structure instead of a-Si:H, (i) layer and the passivation and tunneling effects of the silicon oxide layer were exploited. The photocurrent was decreased with the increase of illumination intensity and SiO2 thickness.
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issn 1110-662X
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language English
publishDate 2012-01-01
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series International Journal of Photoenergy
spelling doaj-art-f7e4eb2176624c98a84997f9cbdc850a2025-02-03T07:25:19ZengWileyInternational Journal of Photoenergy1110-662X1687-529X2012-01-01201210.1155/2012/753456753456Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell ApplicationsYoungseok Lee0Woongkyo Oh1Vinh Ai Dao2Shahzada Qamar Hussain3Junsin Yi4Department of Energy Science, Sungkyunkwan University, Suwon 440-746, Republic of KoreaSchool of Information and Communication Engineering, Sungkyunkwan University, Suwon 440-746, Suwon, Republic of KoreaSchool of Information and Communication Engineering, Sungkyunkwan University, Suwon 440-746, Suwon, Republic of KoreaDepartment of Energy Science, Sungkyunkwan University, Suwon 440-746, Republic of KoreaDepartment of Energy Science, Sungkyunkwan University, Suwon 440-746, Republic of KoreaIt is difficult to deposit extremely thin a-Si:H layer in heterojunction with intrinsic thin layer (HIT) solar cell due to thermal damage and tough process control. This study aims to understand oxide passivation mechanism of silicon surface using rapid thermal oxidation (RTO) process by examining surface effective lifetime and surface recombination velocity. The presence of thin insulating a-Si:H layer is the key to get high Voc by lowering the leakage current (I0) which improves the efficiency of HIT solar cell. The ultrathin thermal passivation silicon oxide (SiO2) layer was deposited by RTO system in the temperature range 500–950°C for 2 to 6 minutes. The thickness of the silicon oxide layer was affected by RTO annealing temperature and treatment time. The best value of surface recombination velocity was recorded for the sample treated at a temperature of 850°C for 6 minutes at O2 flow rate of 3 Lpm. A surface recombination velocity below 25 cm/s was obtained for the silicon oxide layer of 4 nm thickness. This ultrathin SiO2 layer was employed for the fabrication of HIT solar cell structure instead of a-Si:H, (i) layer and the passivation and tunneling effects of the silicon oxide layer were exploited. The photocurrent was decreased with the increase of illumination intensity and SiO2 thickness.http://dx.doi.org/10.1155/2012/753456
spellingShingle Youngseok Lee
Woongkyo Oh
Vinh Ai Dao
Shahzada Qamar Hussain
Junsin Yi
Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell Applications
International Journal of Photoenergy
title Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell Applications
title_full Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell Applications
title_fullStr Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell Applications
title_full_unstemmed Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell Applications
title_short Ultrathin Oxide Passivation Layer by Rapid Thermal Oxidation for the Silicon Heterojunction Solar Cell Applications
title_sort ultrathin oxide passivation layer by rapid thermal oxidation for the silicon heterojunction solar cell applications
url http://dx.doi.org/10.1155/2012/753456
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AT woongkyooh ultrathinoxidepassivationlayerbyrapidthermaloxidationforthesiliconheterojunctionsolarcellapplications
AT vinhaidao ultrathinoxidepassivationlayerbyrapidthermaloxidationforthesiliconheterojunctionsolarcellapplications
AT shahzadaqamarhussain ultrathinoxidepassivationlayerbyrapidthermaloxidationforthesiliconheterojunctionsolarcellapplications
AT junsinyi ultrathinoxidepassivationlayerbyrapidthermaloxidationforthesiliconheterojunctionsolarcellapplications