Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices
To quickly destroy electronic devices and ensure information security, a destruction mechanism of transient electronic devices was designed in this paper. By placing the Ni-Cr film resistance and the energetic material between the chip and the package and heating the resistance by an electric curren...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2020-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/2020/8898943 |
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