Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices
To quickly destroy electronic devices and ensure information security, a destruction mechanism of transient electronic devices was designed in this paper. By placing the Ni-Cr film resistance and the energetic material between the chip and the package and heating the resistance by an electric curren...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2020-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/2020/8898943 |
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| _version_ | 1832554054216056832 |
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| author | Yu Xiao Zhengyuan Zhang Xiyi Liao Feiyu Jiang Yan Wang |
| author_facet | Yu Xiao Zhengyuan Zhang Xiyi Liao Feiyu Jiang Yan Wang |
| author_sort | Yu Xiao |
| collection | DOAJ |
| description | To quickly destroy electronic devices and ensure information security, a destruction mechanism of transient electronic devices was designed in this paper. By placing the Ni-Cr film resistance and the energetic material between the chip and the package and heating the resistance by an electric current, the energetic material expanded and the chip cracked. The information on the chip was destroyed. The author simulated the temperature distribution and stress of the power-on structure in different sizes by ANSYS software. The simulation results indicate that the chip cracks within 50 ms under the trigger current of 0.5 A when a circular groove with an area of 1 mm2 and depth of 0.1 mm is filled with an expansion material with an expansion coefficient of 10−5°C−1. Then, the author prepared a sample for experimental verification. Experimental results show that the sample chip quickly cracks and fails within 10 ms under the trigger current of 1 A. The simulation and experimental results confirm the feasibility of the structure in quick destruction, which lays the foundation for developing instantaneous-failure integrated circuit products to meet information security applications. |
| format | Article |
| id | doaj-art-f59b11e0f47e4f37b56c5162073ec9a0 |
| institution | Kabale University |
| issn | 0882-7516 1563-5031 |
| language | English |
| publishDate | 2020-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Active and Passive Electronic Components |
| spelling | doaj-art-f59b11e0f47e4f37b56c5162073ec9a02025-02-03T05:52:37ZengWileyActive and Passive Electronic Components0882-75161563-50312020-01-01202010.1155/2020/88989438898943Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic DevicesYu Xiao0Zhengyuan Zhang1Xiyi Liao2Feiyu Jiang3Yan Wang4College of Optoelectronic Engineering, Chongqing University of Posts and Telecommunications, Chongqing 400065, ChinaScience and Technology on Analog Integrated Circuit Laboratory, Chongqing 400060, ChinaThe 24th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, ChinaThe 24th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, ChinaScience and Technology on Analog Integrated Circuit Laboratory, Chongqing 400060, ChinaTo quickly destroy electronic devices and ensure information security, a destruction mechanism of transient electronic devices was designed in this paper. By placing the Ni-Cr film resistance and the energetic material between the chip and the package and heating the resistance by an electric current, the energetic material expanded and the chip cracked. The information on the chip was destroyed. The author simulated the temperature distribution and stress of the power-on structure in different sizes by ANSYS software. The simulation results indicate that the chip cracks within 50 ms under the trigger current of 0.5 A when a circular groove with an area of 1 mm2 and depth of 0.1 mm is filled with an expansion material with an expansion coefficient of 10−5°C−1. Then, the author prepared a sample for experimental verification. Experimental results show that the sample chip quickly cracks and fails within 10 ms under the trigger current of 1 A. The simulation and experimental results confirm the feasibility of the structure in quick destruction, which lays the foundation for developing instantaneous-failure integrated circuit products to meet information security applications.http://dx.doi.org/10.1155/2020/8898943 |
| spellingShingle | Yu Xiao Zhengyuan Zhang Xiyi Liao Feiyu Jiang Yan Wang Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices Active and Passive Electronic Components |
| title | Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices |
| title_full | Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices |
| title_fullStr | Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices |
| title_full_unstemmed | Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices |
| title_short | Design, Simulation, and Experimental Verification of a Destruction Mechanism of Transient Electronic Devices |
| title_sort | design simulation and experimental verification of a destruction mechanism of transient electronic devices |
| url | http://dx.doi.org/10.1155/2020/8898943 |
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