Effect of Buffer Charge Redistribution on RF Losses and Harmonic Distortion in GaN-on-Si Substrates

Understanding and mitigation of substrate RF losses and signal distortion are critical to enable high-performance GaN-on-Si front-end-modules. While the origin of RF losses and consequently a decreased effective substrate resistivity <inline-formula> <tex-math notation="LaTeX">...

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Bibliographic Details
Main Authors: Pieter Cardinael, Sachin Yadav, Bertrand Parvais, Jean-Pierre Raskin
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10495002/
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Summary:Understanding and mitigation of substrate RF losses and signal distortion are critical to enable high-performance GaN-on-Si front-end-modules. While the origin of RF losses and consequently a decreased effective substrate resistivity <inline-formula> <tex-math notation="LaTeX">$({\rho }_{eff})$ </tex-math></inline-formula> in GaN-on-Si substrates is now understood to be diffusion of Al and Ga atoms into the silicon substrate during III-N growth, the effect of upper III-N buffer layers on the <inline-formula> <tex-math notation="LaTeX">${\rho }_{eff}$ </tex-math></inline-formula> degradation under stressed conditions remains unclear. In this paper, we show that up to 50&#x0025; variation in <inline-formula> <tex-math notation="LaTeX">${\rho }_{eff}$ </tex-math></inline-formula> at 2 GHz can take place over more than 1,000 s when the substrate is stressed at 50 V. Additionally, Coplanar Wave Guide (CPW) large-signal measurements under the same experimental conditions show a variation of <inline-formula> <tex-math notation="LaTeX">$2^{\mathrm{ nd}}$ </tex-math></inline-formula> harmonic power of up to 5dB. A thermally activated stress and relaxation behavior shows the signature of traps which are present in the C-doped layers. With the help of a simplified TCAD model of the GaN-on-Si stack, we link this behavior to slow charge redistribution in the C-doped buffer continuously modifying the flat-band voltage (<inline-formula> <tex-math notation="LaTeX">$\text{V}_{\text {FB}}$ </tex-math></inline-formula>) of the Metal-Insulator-Semiconductor (MIS) structure. Free carrier transport across the buffer is shown to have the greatest contribution on the large time constants, highlighting the importance of vertical transport paths in GaN-on-Si stacks.
ISSN:2168-6734