Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography
Three-dimensional Mechatronic Integrated Devices (3D-MIDs) combine mechanical and electrical functions, enabling significant component miniaturization and enhanced functionality. However, their application in high-temperature environments remains limited due to material challenges. Existing research...
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MDPI AG
2024-12-01
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| Online Access: | https://www.mdpi.com/2072-666X/16/1/16 |
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| author | Niklas Piechulek Lei Xu Jan Fröhlich Patrick Bründl Jörg Franke |
| author_facet | Niklas Piechulek Lei Xu Jan Fröhlich Patrick Bründl Jörg Franke |
| author_sort | Niklas Piechulek |
| collection | DOAJ |
| description | Three-dimensional Mechatronic Integrated Devices (3D-MIDs) combine mechanical and electrical functions, enabling significant component miniaturization and enhanced functionality. However, their application in high-temperature environments remains limited due to material challenges. Existing research highlights the thermal stability of ceramic substrates; yet, their reliability under high-stress and complex mechanical loading conditions remains a challenge. In this study, 3D-MID components were fabricated using stereolithography (SLA) 3D-printing technology, and the feasibility of circuit miniaturization on high-temperature-resistant resin substrates was explored. Additionally, the influence of laser parameters on resistance values was analyzed using the Response Surface Methodology (RSM). The results demonstrate that SLA 3D-printing achieves substrates with low surface roughness, enabling the precise formation of fine features. Electric circuits are successfully formed on substrates printed with resin mixed with Laser Direct Structuring (LDS) additives, following laser structuring and metallization processes, with a minimum conductor spacing of 150 µm. Furthermore, through the integration of through-holes (vias) and the use of smaller package chips, such as Ball Grid Array (BGA) and Quad Flat No-lead (QFN), the circuits achieve further miniaturization and establish reliable electrical connections via soldering. Taken together, our results demonstrate that thermoset plastics serve as substrates for 3D-MID components, broadening the application scope of 3D-MID technology and providing a framework for circuit miniaturization on SLA-printed substrates. |
| format | Article |
| id | doaj-art-ef8033ff20aa4490a34411b14be14740 |
| institution | Kabale University |
| issn | 2072-666X |
| language | English |
| publishDate | 2024-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj-art-ef8033ff20aa4490a34411b14be147402025-01-24T13:41:50ZengMDPI AGMicromachines2072-666X2024-12-011611610.3390/mi16010016Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by StereolithographyNiklas Piechulek0Lei Xu1Jan Fröhlich2Patrick Bründl3Jörg Franke4Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen Nürnberg, Egerlandstr. 7-9, 91058 Erlangen, GermanyInstitute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen Nürnberg, Egerlandstr. 7-9, 91058 Erlangen, GermanyInstitute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen Nürnberg, Egerlandstr. 7-9, 91058 Erlangen, GermanyInstitute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen Nürnberg, Egerlandstr. 7-9, 91058 Erlangen, GermanyInstitute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen Nürnberg, Egerlandstr. 7-9, 91058 Erlangen, GermanyThree-dimensional Mechatronic Integrated Devices (3D-MIDs) combine mechanical and electrical functions, enabling significant component miniaturization and enhanced functionality. However, their application in high-temperature environments remains limited due to material challenges. Existing research highlights the thermal stability of ceramic substrates; yet, their reliability under high-stress and complex mechanical loading conditions remains a challenge. In this study, 3D-MID components were fabricated using stereolithography (SLA) 3D-printing technology, and the feasibility of circuit miniaturization on high-temperature-resistant resin substrates was explored. Additionally, the influence of laser parameters on resistance values was analyzed using the Response Surface Methodology (RSM). The results demonstrate that SLA 3D-printing achieves substrates with low surface roughness, enabling the precise formation of fine features. Electric circuits are successfully formed on substrates printed with resin mixed with Laser Direct Structuring (LDS) additives, following laser structuring and metallization processes, with a minimum conductor spacing of 150 µm. Furthermore, through the integration of through-holes (vias) and the use of smaller package chips, such as Ball Grid Array (BGA) and Quad Flat No-lead (QFN), the circuits achieve further miniaturization and establish reliable electrical connections via soldering. Taken together, our results demonstrate that thermoset plastics serve as substrates for 3D-MID components, broadening the application scope of 3D-MID technology and providing a framework for circuit miniaturization on SLA-printed substrates.https://www.mdpi.com/2072-666X/16/1/16mechatronic integrated devicesMIDlaser direct structuringSLAminiaturization |
| spellingShingle | Niklas Piechulek Lei Xu Jan Fröhlich Patrick Bründl Jörg Franke Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography Micromachines mechatronic integrated devices MID laser direct structuring SLA miniaturization |
| title | Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography |
| title_full | Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography |
| title_fullStr | Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography |
| title_full_unstemmed | Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography |
| title_short | Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography |
| title_sort | miniaturization potential of additive manufactured 3d mechatronic integrated device components produced by stereolithography |
| topic | mechatronic integrated devices MID laser direct structuring SLA miniaturization |
| url | https://www.mdpi.com/2072-666X/16/1/16 |
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