Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosion
Inhibition effects of an γ-(2,3-epoxypropoxy) propyl-trimethoxy-silane (abbreviated as epoxy-silane) and 3,6-Dioxa-1,8-octanedithiol (abbreviated as DOT) film on copper corrosion in 3.5 wt% NaCl solution were studied by digital hsolography, electrochemical methods and surface characterization approa...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425001425 |
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| author | Chen Sang Juan Qiu Boyu Yuan Kaiyu Zhang Nan Huang Qinghong Wang Houyi Ma Liang Li Chao Wang |
| author_facet | Chen Sang Juan Qiu Boyu Yuan Kaiyu Zhang Nan Huang Qinghong Wang Houyi Ma Liang Li Chao Wang |
| author_sort | Chen Sang |
| collection | DOAJ |
| description | Inhibition effects of an γ-(2,3-epoxypropoxy) propyl-trimethoxy-silane (abbreviated as epoxy-silane) and 3,6-Dioxa-1,8-octanedithiol (abbreviated as DOT) film on copper corrosion in 3.5 wt% NaCl solution were studied by digital hsolography, electrochemical methods and surface characterization approaches. In-situ observation of the concentration change at the electrode/electrolyte interface during dynamic potential scan by holography revealed that the dissolution of copper was inhibited significantly and no CuCl film formation was found on the surface of the modified film. Sputtering measurements by X-ray photoelectron spectroscopy showed that some Cl− ions permeated into the outer layer of the epoxy-silane/DOT film and formed CuCl interlayer with the Cu+ ions in the film. The CuCl interlayer in the modified film blocked its micropores, inhibiting the copper corrosion. The initial electro-dissolution reactions on bare copper and modified copper have been discussed accordingly. The study proved the digital holography to be an effective method to evaluate anti-corrosion performance and elucidate the related mechanisms in particularly. |
| format | Article |
| id | doaj-art-ef232b006bbf434dab67cd3e9269770b |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-ef232b006bbf434dab67cd3e9269770b2025-01-26T05:03:56ZengElsevierJournal of Materials Research and Technology2238-78542025-03-013519411949Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosionChen Sang0Juan Qiu1Boyu Yuan2Kaiyu Zhang3Nan Huang4Qinghong Wang5Houyi Ma6Liang Li7Chao Wang8Jiangsu Key Laboratory of Advanced Laser Materials and Devices, School of Physics and Electronic Engineering, Jiangsu Normal University, Xuzhou, 221116, ChinaKey Laboratory of Colloid and Interface Chemistry of State Education Ministry, School of Chemistry and Chemical Engineering, Shandong University, Jinan, 250100, ChinaJiangsu Key Laboratory of Advanced Laser Materials and Devices, School of Physics and Electronic Engineering, Jiangsu Normal University, Xuzhou, 221116, China; Corresponding author.Jiangsu Key Laboratory of Advanced Laser Materials and Devices, School of Physics and Electronic Engineering, Jiangsu Normal University, Xuzhou, 221116, ChinaSchool of Chemistry & Materials Science, Jiangsu Normal University, Xuzhou, 221116, ChinaSchool of Chemistry & Materials Science, Jiangsu Normal University, Xuzhou, 221116, China; Corresponding author.Key Laboratory of Colloid and Interface Chemistry of State Education Ministry, School of Chemistry and Chemical Engineering, Shandong University, Jinan, 250100, ChinaSchool of Chemistry & Materials Science, Jiangsu Normal University, Xuzhou, 221116, ChinaSchool of Chemistry & Materials Science, Jiangsu Normal University, Xuzhou, 221116, China; Corresponding author.Inhibition effects of an γ-(2,3-epoxypropoxy) propyl-trimethoxy-silane (abbreviated as epoxy-silane) and 3,6-Dioxa-1,8-octanedithiol (abbreviated as DOT) film on copper corrosion in 3.5 wt% NaCl solution were studied by digital hsolography, electrochemical methods and surface characterization approaches. In-situ observation of the concentration change at the electrode/electrolyte interface during dynamic potential scan by holography revealed that the dissolution of copper was inhibited significantly and no CuCl film formation was found on the surface of the modified film. Sputtering measurements by X-ray photoelectron spectroscopy showed that some Cl− ions permeated into the outer layer of the epoxy-silane/DOT film and formed CuCl interlayer with the Cu+ ions in the film. The CuCl interlayer in the modified film blocked its micropores, inhibiting the copper corrosion. The initial electro-dissolution reactions on bare copper and modified copper have been discussed accordingly. The study proved the digital holography to be an effective method to evaluate anti-corrosion performance and elucidate the related mechanisms in particularly.http://www.sciencedirect.com/science/article/pii/S2238785425001425CopperSelf-assembled epoxy-silane/dithiol filmElectrode/electrolyte interfaceInhibition mechanismDigital holography |
| spellingShingle | Chen Sang Juan Qiu Boyu Yuan Kaiyu Zhang Nan Huang Qinghong Wang Houyi Ma Liang Li Chao Wang Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosion Journal of Materials Research and Technology Copper Self-assembled epoxy-silane/dithiol film Electrode/electrolyte interface Inhibition mechanism Digital holography |
| title | Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosion |
| title_full | Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosion |
| title_fullStr | Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosion |
| title_full_unstemmed | Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosion |
| title_short | Inhibition mechanism of self-assembled epoxy-silane/dithiol film on copper corrosion |
| title_sort | inhibition mechanism of self assembled epoxy silane dithiol film on copper corrosion |
| topic | Copper Self-assembled epoxy-silane/dithiol film Electrode/electrolyte interface Inhibition mechanism Digital holography |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425001425 |
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