Titanium Silicide Formation in Presence of Oxygen

In-situ resistivity vs. temperature, Rutherford backscattering spectrometry, Auger electron spectroscopy and X-ray diffraction measurements have been performed in order to study the effects arising from the presence of oxygen in the annealing ambient on the integrity of amorphous films of TiSix, wit...

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Main Authors: C. Nobili, F. Nava, G. Ottaviani, M. Costato, G. De Santi, G. Queirolo
Format: Article
Language:English
Published: Wiley 1992-01-01
Series:Active and Passive Electronic Components
Subjects:
Online Access:http://dx.doi.org/10.1155/1992/94394
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author C. Nobili
F. Nava
G. Ottaviani
M. Costato
G. De Santi
G. Queirolo
author_facet C. Nobili
F. Nava
G. Ottaviani
M. Costato
G. De Santi
G. Queirolo
author_sort C. Nobili
collection DOAJ
description In-situ resistivity vs. temperature, Rutherford backscattering spectrometry, Auger electron spectroscopy and X-ray diffraction measurements have been performed in order to study the effects arising from the presence of oxygen in the annealing ambient on the integrity of amorphous films of TiSix, with x ranging from 1.45 to 2.1. Crystalisation occurs around 400 C. The presence of oxygen produces the formation of silicon and titanium oxide around 500 C. Critical analysis of the experimental results have indicated that metal oxidation is inhibited when an excess of silicon is present, which suggests the use of a sputtered Si coating cap as a medium capable of effectively decoupling the silicide film from oxygen. This avoids unwanted Ti oxidation even in heavily oxygen contaminated ambients up to the highest temperatures used for the formation of low resistivity titanium disilicide.
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institution Kabale University
issn 0882-7516
1563-5031
language English
publishDate 1992-01-01
publisher Wiley
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series Active and Passive Electronic Components
spelling doaj-art-ef191846488d4eeababefebc56782d362025-02-03T01:11:23ZengWileyActive and Passive Electronic Components0882-75161563-50311992-01-0115192610.1155/1992/94394Titanium Silicide Formation in Presence of OxygenC. Nobili0F. Nava1G. Ottaviani2M. Costato3G. De Santi4G. Queirolo5Dipartimento di Fisica Universita' di Modena, via Campi 213/a, Modena 1-41100, ItalyDipartimento di Fisica Universita' di Modena, via Campi 213/a, Modena 1-41100, ItalyDipartimento di Fisica Universita' di Modena, via Campi 213/a, Modena 1-41100, ItalyDipartimento di Fisica Universita' di Modena, via Campi 213/a, Modena 1-41100, ItalySGS, via Olivetti 2, 1-20041 Agrate Brianza, Milano, ItalySGS, via Olivetti 2, 1-20041 Agrate Brianza, Milano, ItalyIn-situ resistivity vs. temperature, Rutherford backscattering spectrometry, Auger electron spectroscopy and X-ray diffraction measurements have been performed in order to study the effects arising from the presence of oxygen in the annealing ambient on the integrity of amorphous films of TiSix, with x ranging from 1.45 to 2.1. Crystalisation occurs around 400 C. The presence of oxygen produces the formation of silicon and titanium oxide around 500 C. Critical analysis of the experimental results have indicated that metal oxidation is inhibited when an excess of silicon is present, which suggests the use of a sputtered Si coating cap as a medium capable of effectively decoupling the silicide film from oxygen. This avoids unwanted Ti oxidation even in heavily oxygen contaminated ambients up to the highest temperatures used for the formation of low resistivity titanium disilicide.http://dx.doi.org/10.1155/1992/94394Titanium Siliciderf SputteringResistivity vs. TemperatureRutherford Backscattering SpectrometryAuger SpectroscopyX-Ray Diffraction.
spellingShingle C. Nobili
F. Nava
G. Ottaviani
M. Costato
G. De Santi
G. Queirolo
Titanium Silicide Formation in Presence of Oxygen
Active and Passive Electronic Components
Titanium Silicide
rf Sputtering
Resistivity vs. Temperature
Rutherford Backscattering Spectrometry
Auger Spectroscopy
X-Ray Diffraction.
title Titanium Silicide Formation in Presence of Oxygen
title_full Titanium Silicide Formation in Presence of Oxygen
title_fullStr Titanium Silicide Formation in Presence of Oxygen
title_full_unstemmed Titanium Silicide Formation in Presence of Oxygen
title_short Titanium Silicide Formation in Presence of Oxygen
title_sort titanium silicide formation in presence of oxygen
topic Titanium Silicide
rf Sputtering
Resistivity vs. Temperature
Rutherford Backscattering Spectrometry
Auger Spectroscopy
X-Ray Diffraction.
url http://dx.doi.org/10.1155/1992/94394
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AT fnava titaniumsilicideformationinpresenceofoxygen
AT gottaviani titaniumsilicideformationinpresenceofoxygen
AT mcostato titaniumsilicideformationinpresenceofoxygen
AT gdesanti titaniumsilicideformationinpresenceofoxygen
AT gqueirolo titaniumsilicideformationinpresenceofoxygen