Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding
Workpiece rotational grinding is widely used in the ultra-precision machining of hard and brittle semiconductor materials, including single-crystal silicon, silicon carbide, and gallium arsenide. Surface roughness and subsurface damage depth (SDD) are crucial indicators for evaluating the surface qu...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2025-01-01
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| Series: | International Journal of Extreme Manufacturing |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2631-7990/adae67 |
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