Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatment

The T4 heat treatment process is essential for hot-press sintered aluminum matrix composites. This study investigates the evolution mechanism of novel T4 (TiC + B4C)/6061Al composites by combining vacuum hot-press sintering with various T4 heat treatments. Results show that due to the addition of B4...

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Main Authors: Zhaosong Liu, Zongan Luo, Xin Zhang, Yingying Feng, Jinsong Yang
Format: Article
Language:English
Published: Elsevier 2025-01-01
Series:Journal of Materials Research and Technology
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Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424028412
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author Zhaosong Liu
Zongan Luo
Xin Zhang
Yingying Feng
Jinsong Yang
author_facet Zhaosong Liu
Zongan Luo
Xin Zhang
Yingying Feng
Jinsong Yang
author_sort Zhaosong Liu
collection DOAJ
description The T4 heat treatment process is essential for hot-press sintered aluminum matrix composites. This study investigates the evolution mechanism of novel T4 (TiC + B4C)/6061Al composites by combining vacuum hot-press sintering with various T4 heat treatments. Results show that due to the addition of B4C, in-situ SiC and diffusion of B appeared in T4 (TiC + B4C)/6061Al composites. Severe grain boundary segregation of Mg occurred in T4 6061Al, while grain boundary segregation of Mg is noticeably reduced in T4 (TiC + B4C)/6061Al composites. Unlike the ductile fracture and intergranular fracture observed in T4 6061Al, fracture in T4 (TiC + B4C)/6061Al composites predominantly occurs through ductile fracture of the aluminum matrix and cleavage fracture of particles. During T4 heat treatment, the addition of TiC and B4C not only refined the grain size of 6061Al but also promoted the occurrence of static recrystallization of 6061Al. With the increase of solution temperature, the recrystallization volume fraction of the aluminum matrix in T4 (TiC + B4C)/6061Al composites first increased and then decreased slightly, the hardness and strength of T4 (TiC + B4C)/6061Al composites increased gradually, the plasticity first increased and then decreased. An optimal balance between strength and plasticity in T4 (TiC + B4C)/6061Al composites can be achieved at the solution temperature of 530 °C.
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spelling doaj-art-ed07cd456fc344278642a6a66c6a1cce2025-01-19T06:25:09ZengElsevierJournal of Materials Research and Technology2238-78542025-01-0134311327Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatmentZhaosong Liu0Zongan Luo1Xin Zhang2Yingying Feng3Jinsong Yang4The State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, 110819, ChinaCorresponding author.; The State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, 110819, ChinaThe State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, 110819, ChinaThe State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, 110819, ChinaThe State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, 110819, ChinaThe T4 heat treatment process is essential for hot-press sintered aluminum matrix composites. This study investigates the evolution mechanism of novel T4 (TiC + B4C)/6061Al composites by combining vacuum hot-press sintering with various T4 heat treatments. Results show that due to the addition of B4C, in-situ SiC and diffusion of B appeared in T4 (TiC + B4C)/6061Al composites. Severe grain boundary segregation of Mg occurred in T4 6061Al, while grain boundary segregation of Mg is noticeably reduced in T4 (TiC + B4C)/6061Al composites. Unlike the ductile fracture and intergranular fracture observed in T4 6061Al, fracture in T4 (TiC + B4C)/6061Al composites predominantly occurs through ductile fracture of the aluminum matrix and cleavage fracture of particles. During T4 heat treatment, the addition of TiC and B4C not only refined the grain size of 6061Al but also promoted the occurrence of static recrystallization of 6061Al. With the increase of solution temperature, the recrystallization volume fraction of the aluminum matrix in T4 (TiC + B4C)/6061Al composites first increased and then decreased slightly, the hardness and strength of T4 (TiC + B4C)/6061Al composites increased gradually, the plasticity first increased and then decreased. An optimal balance between strength and plasticity in T4 (TiC + B4C)/6061Al composites can be achieved at the solution temperature of 530 °C.http://www.sciencedirect.com/science/article/pii/S2238785424028412T4 heat treatmentSinteringCompositesSegregationSolution temperature
spellingShingle Zhaosong Liu
Zongan Luo
Xin Zhang
Yingying Feng
Jinsong Yang
Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatment
Journal of Materials Research and Technology
T4 heat treatment
Sintering
Composites
Segregation
Solution temperature
title Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatment
title_full Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatment
title_fullStr Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatment
title_full_unstemmed Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatment
title_short Study on Mg segregation, microstructure evolution and fracture behavior of hot-press sintered (TiC+B4C)/6061Al composites after T4 heat treatment
title_sort study on mg segregation microstructure evolution and fracture behavior of hot press sintered tic b4c 6061al composites after t4 heat treatment
topic T4 heat treatment
Sintering
Composites
Segregation
Solution temperature
url http://www.sciencedirect.com/science/article/pii/S2238785424028412
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