Effect of Interlayer Stress on U Bends and Water Droplet Bends
The interlayer stress (IS) analysis of the flexible active-matrix organic light-emitting diode (AMOLED) panel is critical for decreasing the stress concentration and reducing the risk of overall screen failure. This article relies on the linear elastic models of ABAQUS to simulate finite element ana...
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2022-01-01
|
| Series: | Journal of Engineering |
| Online Access: | http://dx.doi.org/10.1155/2022/1796876 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1832551709224730624 |
|---|---|
| author | Qiujun Wang Weiwei Su Wenxin Zhang Zeyu Zhang Bo Wang Di Zhang Fang Zhang |
| author_facet | Qiujun Wang Weiwei Su Wenxin Zhang Zeyu Zhang Bo Wang Di Zhang Fang Zhang |
| author_sort | Qiujun Wang |
| collection | DOAJ |
| description | The interlayer stress (IS) analysis of the flexible active-matrix organic light-emitting diode (AMOLED) panel is critical for decreasing the stress concentration and reducing the risk of overall screen failure. This article relies on the linear elastic models of ABAQUS to simulate finite element analysis of foldable panels. This article discussed three sensitive locations of the flexible AMOLED panel caused by two different bending methods including U bends and water droplet bends. The finite element method for simulating the layer analysis was constructed to analyze the effect of optically clear adhesive (OCA) film thickness on the distribution of stress and strain. The module can be optimized by changing the thickness and shear modulus of OCA. With the decrease of OCA thickness and the increase of stiffness, the maximum stress of the organic light-emitting diode (OLED) layer is decreased by 20% which is 55 Mpa; meanwhile, the IS of the entire module is reduced by about 30%. |
| format | Article |
| id | doaj-art-ea10082cb5884a6e8aabe2ce4675a403 |
| institution | Kabale University |
| issn | 2314-4912 |
| language | English |
| publishDate | 2022-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Journal of Engineering |
| spelling | doaj-art-ea10082cb5884a6e8aabe2ce4675a4032025-02-03T06:00:55ZengWileyJournal of Engineering2314-49122022-01-01202210.1155/2022/1796876Effect of Interlayer Stress on U Bends and Water Droplet BendsQiujun Wang0Weiwei Su1Wenxin Zhang2Zeyu Zhang3Bo Wang4Di Zhang5Fang Zhang6Hebei Key Laboratory of Flexible Functional MaterialsHebei Key Laboratory of Flexible Functional MaterialsHebei Key Laboratory of Flexible Functional MaterialsHebei Key Laboratory of Flexible Functional MaterialsHebei Key Laboratory of Flexible Functional MaterialsHebei Key Laboratory of Flexible Functional MaterialsYungu (Gu’an) Technology Co., LtdThe interlayer stress (IS) analysis of the flexible active-matrix organic light-emitting diode (AMOLED) panel is critical for decreasing the stress concentration and reducing the risk of overall screen failure. This article relies on the linear elastic models of ABAQUS to simulate finite element analysis of foldable panels. This article discussed three sensitive locations of the flexible AMOLED panel caused by two different bending methods including U bends and water droplet bends. The finite element method for simulating the layer analysis was constructed to analyze the effect of optically clear adhesive (OCA) film thickness on the distribution of stress and strain. The module can be optimized by changing the thickness and shear modulus of OCA. With the decrease of OCA thickness and the increase of stiffness, the maximum stress of the organic light-emitting diode (OLED) layer is decreased by 20% which is 55 Mpa; meanwhile, the IS of the entire module is reduced by about 30%.http://dx.doi.org/10.1155/2022/1796876 |
| spellingShingle | Qiujun Wang Weiwei Su Wenxin Zhang Zeyu Zhang Bo Wang Di Zhang Fang Zhang Effect of Interlayer Stress on U Bends and Water Droplet Bends Journal of Engineering |
| title | Effect of Interlayer Stress on U Bends and Water Droplet Bends |
| title_full | Effect of Interlayer Stress on U Bends and Water Droplet Bends |
| title_fullStr | Effect of Interlayer Stress on U Bends and Water Droplet Bends |
| title_full_unstemmed | Effect of Interlayer Stress on U Bends and Water Droplet Bends |
| title_short | Effect of Interlayer Stress on U Bends and Water Droplet Bends |
| title_sort | effect of interlayer stress on u bends and water droplet bends |
| url | http://dx.doi.org/10.1155/2022/1796876 |
| work_keys_str_mv | AT qiujunwang effectofinterlayerstressonubendsandwaterdropletbends AT weiweisu effectofinterlayerstressonubendsandwaterdropletbends AT wenxinzhang effectofinterlayerstressonubendsandwaterdropletbends AT zeyuzhang effectofinterlayerstressonubendsandwaterdropletbends AT bowang effectofinterlayerstressonubendsandwaterdropletbends AT dizhang effectofinterlayerstressonubendsandwaterdropletbends AT fangzhang effectofinterlayerstressonubendsandwaterdropletbends |