Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints
The service temperature of power electronic components is much higher than normal temperature， and the mismatch between heat generation and heat dissipation of devices is becoming increasingly prominent. The good thermal conductivity of foamed Cu is used to fill the welding material with PbSnAg al...
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| Format: | Article |
| Language: | zho |
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Harbin University of Science and Technology Publications
2021-06-01
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| Series: | Journal of Harbin University of Science and Technology |
| Subjects: | |
| Online Access: | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1972 |
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| _version_ | 1849337798388088832 |
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| author | LIU Gui-yuan SUN Feng-lian |
| author_facet | LIU Gui-yuan SUN Feng-lian |
| author_sort | LIU Gui-yuan |
| collection | DOAJ |
| description | The service temperature of power electronic components is much higher than normal temperature，
and the mismatch between heat generation and heat dissipation of devices is becoming increasingly prominent. The
good thermal conductivity of foamed Cu is used to fill the welding material with PbSnAg alloy. It is expected to
improve the thermal conductivity of existing PbSnAg joints. The study focused on thermal resistance ，microstructure
and shear strength of the copper foam enhanced Cu /Pb-Sn-Ag /Cu joint. The microstructure of PbSnAg alloy is
consists of matrix high lead and the mixed structure of high lead and IMCs ( intermetallic compounds ) .
Experimental result shows that the grain of PbSnAg coarsened after the addition of Cu foam. The component of the
IMCs at the copper foam and the Cu substrate are Cu3Sn. A layer with high Pb content was found between Cu and
Cu3Sn. The shear strength of the solder joint decreases slightly due to the addition of the copper foam，and the
Cu3Sn IMCs can be found on the shear fracture. |
| format | Article |
| id | doaj-art-e9cfa9bdc3ec49d0987f62e0e21de0e6 |
| institution | Kabale University |
| issn | 1007-2683 |
| language | zho |
| publishDate | 2021-06-01 |
| publisher | Harbin University of Science and Technology Publications |
| record_format | Article |
| series | Journal of Harbin University of Science and Technology |
| spelling | doaj-art-e9cfa9bdc3ec49d0987f62e0e21de0e62025-08-20T03:44:35ZzhoHarbin University of Science and Technology PublicationsJournal of Harbin University of Science and Technology1007-26832021-06-01260312713310.15938/j.jhust.2021.03.019Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu JointsLIU Gui-yuan0SUN Feng-lian1School of Material Science and Engineering，Harbin University of Science and Technology，Harbin 150040，ChinaSchool of Material Science and Engineering，Harbin University of Science and Technology，Harbin 150040，ChinaThe service temperature of power electronic components is much higher than normal temperature， and the mismatch between heat generation and heat dissipation of devices is becoming increasingly prominent. The good thermal conductivity of foamed Cu is used to fill the welding material with PbSnAg alloy. It is expected to improve the thermal conductivity of existing PbSnAg joints. The study focused on thermal resistance ，microstructure and shear strength of the copper foam enhanced Cu /Pb-Sn-Ag /Cu joint. The microstructure of PbSnAg alloy is consists of matrix high lead and the mixed structure of high lead and IMCs ( intermetallic compounds ) . Experimental result shows that the grain of PbSnAg coarsened after the addition of Cu foam. The component of the IMCs at the copper foam and the Cu substrate are Cu3Sn. A layer with high Pb content was found between Cu and Cu3Sn. The shear strength of the solder joint decreases slightly due to the addition of the copper foam，and the Cu3Sn IMCs can be found on the shear fracture.https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1972cu foampbsnag solderthermal resistancemicrostructureshear strength |
| spellingShingle | LIU Gui-yuan SUN Feng-lian Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints Journal of Harbin University of Science and Technology cu foam pbsnag solder thermal resistance microstructure shear strength |
| title | Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints |
| title_full | Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints |
| title_fullStr | Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints |
| title_full_unstemmed | Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints |
| title_short | Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints |
| title_sort | effect of cu foam on the thermal resistance and strength of as soldered pb5sn2 5ag cu joints |
| topic | cu foam pbsnag solder thermal resistance microstructure shear strength |
| url | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1972 |
| work_keys_str_mv | AT liuguiyuan effectofcufoamonthethermalresistanceandstrengthofassolderedpb5sn25agcujoints AT sunfenglian effectofcufoamonthethermalresistanceandstrengthofassolderedpb5sn25agcujoints |