Gui-yuan, L., & Feng-lian, S. Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints. Harbin University of Science and Technology Publications.
Chicago Style (17th ed.) CitationGui-yuan, LIU, and SUN Feng-lian. Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints. Harbin University of Science and Technology Publications.
MLA (9th ed.) CitationGui-yuan, LIU, and SUN Feng-lian. Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints. Harbin University of Science and Technology Publications.
Warning: These citations may not always be 100% accurate.