High-temperature Reliability of 1 200 V SiC Power MOSFETs

High-temperature reliability is currently a key issue limiting the application of SiC MOSFET devices in high-temperature environment. It intruduced the DC electrical performance of 1 200 V SiC MOSFETs, which was fabricated based on domestic process platform, and then its high-temperature reliability...

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Bibliographic Details
Main Authors: DENG Xiaochuan, CHEN Xixi, WANG Yiyu, SHEN Huajun, TANG Yachao, GAO Yunbing
Format: Article
Language:zho
Published: Editorial Office of Control and Information Technology 2016-01-01
Series:Kongzhi Yu Xinxi Jishu
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Online Access:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.05.013
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Summary:High-temperature reliability is currently a key issue limiting the application of SiC MOSFET devices in high-temperature environment. It intruduced the DC electrical performance of 1 200 V SiC MOSFETs, which was fabricated based on domestic process platform, and then its high-temperature reliability was analyzed after high temperature gate-bias test (HTGB) and high temperature reversebias test (HTRB). The experimental results indicated that after 168 hours HTGB and HTRB tests, breakdown voltage of the fabricated samples is more than 1 200 V and the variations of threshold voltage and on-resistance are less than 15% respectively, suggesting good robustness of these devices. It also confirms the feasibility of the design, process and fabrication of domestic 1 200 V SiC MOSFETs.
ISSN:2096-5427