Research on Wafer CMP Temperature Online Detection Compensation Algorithm Based on GA-BP Improved Neural Network
In chemical mechanical polishing (CMP), temperature is a primary factor that determines the rate of chemical reactions, which directly influences the polishing efficiency and quality of wafers. Therefore, constructing an online monitoring system for wafer temperature to enable real-time feedback con...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10982261/ |
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