Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface
Abstract Room‐temperature liquid metal has been widely used in electronic packaging due to its high thermal conductivity, but its thermal performance is strongly impeded by the dominated thermal boundary resistance between liquid metal and solid material. Here, first an order‐of‐magnitude reduction...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley-VCH
2025-06-01
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| Series: | Advanced Materials Interfaces |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/admi.202500041 |
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