Pita, M., & Lebea, L. Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes. Wiley.
Chicago Style (17th ed.) CitationPita, M., and L. Lebea. Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material Before Accumulative Roll Bonding Processes. Wiley.
MLA (9th ed.) CitationPita, M., and L. Lebea. Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material Before Accumulative Roll Bonding Processes. Wiley.
Warning: These citations may not always be 100% accurate.