Numerical Study of Fluid Flow, Heat Transfer and Parameter Coupling in a Spider Web Microchannel Heat Sink

The microchannel heat sink is a commonly used structure in mechanical cooling systems for microelectronics. Based on bionics, a simplified heat sink with a spider-web design is proposed in this paper. Under the condition of bottom heat flux q = 100 W/cm2 and Reynolds number (Re) = 442–884, the influ...

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Bibliographic Details
Main Authors: L. Chen, Y. Kang, S. Kao-Walter
Format: Article
Language:English
Published: Isfahan University of Technology 2025-05-01
Series:Journal of Applied Fluid Mechanics
Subjects:
Online Access:https://www.jafmonline.net/article_2665_86cb86a07ddc3c21b6f6af1680fd649e.pdf
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