Numerical Study of Fluid Flow, Heat Transfer and Parameter Coupling in a Spider Web Microchannel Heat Sink
The microchannel heat sink is a commonly used structure in mechanical cooling systems for microelectronics. Based on bionics, a simplified heat sink with a spider-web design is proposed in this paper. Under the condition of bottom heat flux q = 100 W/cm2 and Reynolds number (Re) = 442–884, the influ...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Isfahan University of Technology
2025-05-01
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| Series: | Journal of Applied Fluid Mechanics |
| Subjects: | |
| Online Access: | https://www.jafmonline.net/article_2665_86cb86a07ddc3c21b6f6af1680fd649e.pdf |
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