Individual and interactive action mechanisms of mechanical, chemical, and electrical factors in Co polishing
With the continuous miniaturization of integrated circuit (IC) devices, Co is recognized as the most promising alternative to Cu as an interconnecting metal. During IC processing, Co surfaces need to be flattened. This work describes dynamic polishing experiments and static corrosion experiments on...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Tsinghua University Press
2025-06-01
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| Series: | Friction |
| Subjects: | |
| Online Access: | https://www.sciopen.com/article/10.26599/FRICT.2025.9440961 |
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