On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence characters

Featured with light emission and detection coexistence phenomenon, nitride-based multiple-quantum-well (MQW) diodes integrated chip has been proven to be an attractive structure for application prospects in various fields such as lighting, sensing, optical communication, and other fields. However, m...

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Main Authors: Feifei Qin, Xueyao Lu, Xiaoxuan Wang, Chunxiang Guo, Jiaqi Wu, Xuefeng Fan, Mingming Jiang, Peng Wan, Junfeng Lu, Yongjin Wang, Gangyi Zhu
Format: Article
Language:English
Published: Elsevier 2024-12-01
Series:Chip
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Online Access:http://www.sciencedirect.com/science/article/pii/S2709472324000339
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author Feifei Qin
Xueyao Lu
Xiaoxuan Wang
Chunxiang Guo
Jiaqi Wu
Xuefeng Fan
Mingming Jiang
Peng Wan
Junfeng Lu
Yongjin Wang
Gangyi Zhu
author_facet Feifei Qin
Xueyao Lu
Xiaoxuan Wang
Chunxiang Guo
Jiaqi Wu
Xuefeng Fan
Mingming Jiang
Peng Wan
Junfeng Lu
Yongjin Wang
Gangyi Zhu
author_sort Feifei Qin
collection DOAJ
description Featured with light emission and detection coexistence phenomenon, nitride-based multiple-quantum-well (MQW) diodes integrated chip has been proven to be an attractive structure for application prospects in various fields such as lighting, sensing, optical communication, and other fields. However, most of the recent reports are based on planar structures. Three-dimensional (3D) structures are endowed with extra advantages in direction, polarization, and absorption modulation and may pioneer a new way to make the same thing over and over again with interesting properties. In this paper, we designed and fabricated a single-cantilever InGaN/GaN MQW diode with warped 3D microstructure via standard microfabrication technology. Experimental results indicate that the strain architecture of the multi-layer materials is the key principle for the self-warped device. The planar structure will bear greater compressive stress while the warped beam part has less stress, which results in differences in the optical and electrical performance. The strain-induced band bending highly influences the emission and detection properties, while the warped structure will introduce direction selectivity to the 3D device. As an emitter, 3D structures exhibit a directional emission with lower turn-on voltage, higher capacitance, increased luminous intensity, higher external quantum efficiency (EQE), high –3 dB bandwidth, and redshifted peak wavelength. Besides, it can serve as an emitter for directional-related optical communication. As a receiver, 3D structures have lower dark-current, higher photocurrent, and red-shifted response spectrum and also show directional dependence. These findings not only deepen the understanding of the working principle of the single-cantilever GaN devices but also provide important references for device performance optimization and new applications in visible light communication (VLC) technology.
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publishDate 2024-12-01
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spelling doaj-art-e032ce86f91c4b5b875033132ab3c8392025-08-20T02:56:55ZengElsevierChip2709-47232024-12-013410011510.1016/j.chip.2024.100115On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence charactersFeifei Qin0Xueyao Lu1Xiaoxuan Wang2Chunxiang Guo3Jiaqi Wu4Xuefeng Fan5Mingming Jiang6Peng Wan7Junfeng Lu8Yongjin Wang9Gangyi Zhu10GaN Optoelectronic Integration International Cooperation Joint Laboratory of Jiangsu Province, Nanjing University of Posts and Telecommunications, Nanjing 210003, ChinaGaN Optoelectronic Integration International Cooperation Joint Laboratory of Jiangsu Province, Nanjing University of Posts and Telecommunications, Nanjing 210003, ChinaState Key Laboratory of Digital Medical Engineering, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China; Corresponding authors.Jiangsu Leuven Instruments Co., Ltd., Liaohe West Road 8, Pizhou 221300, Jiangsu, ChinaGaN Optoelectronic Integration International Cooperation Joint Laboratory of Jiangsu Province, Nanjing University of Posts and Telecommunications, Nanjing 210003, ChinaGaN Optoelectronic Integration International Cooperation Joint Laboratory of Jiangsu Province, Nanjing University of Posts and Telecommunications, Nanjing 210003, ChinaCollege of Physics, MIIT Key Laboratory of Aerospace Information Materials and Physics, Key Laboratory for Intelligent Nano Materials and Devices, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, ChinaCollege of Physics, MIIT Key Laboratory of Aerospace Information Materials and Physics, Key Laboratory for Intelligent Nano Materials and Devices, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, ChinaCollege of Physics, MIIT Key Laboratory of Aerospace Information Materials and Physics, Key Laboratory for Intelligent Nano Materials and Devices, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, ChinaGaN Optoelectronic Integration International Cooperation Joint Laboratory of Jiangsu Province, Nanjing University of Posts and Telecommunications, Nanjing 210003, China; Corresponding authors.GaN Optoelectronic Integration International Cooperation Joint Laboratory of Jiangsu Province, Nanjing University of Posts and Telecommunications, Nanjing 210003, China; Corresponding authors.Featured with light emission and detection coexistence phenomenon, nitride-based multiple-quantum-well (MQW) diodes integrated chip has been proven to be an attractive structure for application prospects in various fields such as lighting, sensing, optical communication, and other fields. However, most of the recent reports are based on planar structures. Three-dimensional (3D) structures are endowed with extra advantages in direction, polarization, and absorption modulation and may pioneer a new way to make the same thing over and over again with interesting properties. In this paper, we designed and fabricated a single-cantilever InGaN/GaN MQW diode with warped 3D microstructure via standard microfabrication technology. Experimental results indicate that the strain architecture of the multi-layer materials is the key principle for the self-warped device. The planar structure will bear greater compressive stress while the warped beam part has less stress, which results in differences in the optical and electrical performance. The strain-induced band bending highly influences the emission and detection properties, while the warped structure will introduce direction selectivity to the 3D device. As an emitter, 3D structures exhibit a directional emission with lower turn-on voltage, higher capacitance, increased luminous intensity, higher external quantum efficiency (EQE), high –3 dB bandwidth, and redshifted peak wavelength. Besides, it can serve as an emitter for directional-related optical communication. As a receiver, 3D structures have lower dark-current, higher photocurrent, and red-shifted response spectrum and also show directional dependence. These findings not only deepen the understanding of the working principle of the single-cantilever GaN devices but also provide important references for device performance optimization and new applications in visible light communication (VLC) technology.http://www.sciencedirect.com/science/article/pii/S2709472324000339Three-dimensional deviceSelf-warped structuresSingle cantileverGaN light-emitting diodeDirectional emission and detection
spellingShingle Feifei Qin
Xueyao Lu
Xiaoxuan Wang
Chunxiang Guo
Jiaqi Wu
Xuefeng Fan
Mingming Jiang
Peng Wan
Junfeng Lu
Yongjin Wang
Gangyi Zhu
On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence characters
Chip
Three-dimensional device
Self-warped structures
Single cantilever
GaN light-emitting diode
Directional emission and detection
title On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence characters
title_full On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence characters
title_fullStr On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence characters
title_full_unstemmed On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence characters
title_short On-chip warped three-dimensional InGaN/GaN quantum well diode with transceiver coexistence characters
title_sort on chip warped three dimensional ingan gan quantum well diode with transceiver coexistence characters
topic Three-dimensional device
Self-warped structures
Single cantilever
GaN light-emitting diode
Directional emission and detection
url http://www.sciencedirect.com/science/article/pii/S2709472324000339
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