Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks
Abstract Rapid advancements in electronic devices yield an urgent demand for high‐performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the req...
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| Format: | Article |
| Language: | English |
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Wiley
2024-10-01
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| Series: | Advanced Science |
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| Online Access: | https://doi.org/10.1002/advs.202404838 |
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| author | Minjun Ai Yuzhu Song Feixiang Long Yuanpeng Zhang Ke An Dunji Yu Yan Chen Yuki Sakai Masahito Ikeda Kazuki Takahashi Masaki Azuma Naike Shi Chang Zhou Jun Chen |
| author_facet | Minjun Ai Yuzhu Song Feixiang Long Yuanpeng Zhang Ke An Dunji Yu Yan Chen Yuki Sakai Masahito Ikeda Kazuki Takahashi Masaki Azuma Naike Shi Chang Zhou Jun Chen |
| author_sort | Minjun Ai |
| collection | DOAJ |
| description | Abstract Rapid advancements in electronic devices yield an urgent demand for high‐performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the requirements simultaneously. Here, an effective strategy is proposed for significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy (Zr,Nb)Fe2 through eutectic precipitation of copper networks. The eutectic dual‐phase alloy exhibits an isotropic chips‐matched thermal expansion coefficient and a thermal conductivity enhancement exceeding 200% compared with (Zr,Nb)Fe2, along with an ultimate compressive strength of 550 MPa. The addition of copper reorganizes the composition of (Zr,Nb)Fe2, which smooths the magnetic transition and shifts it toward higher temperature, resulting in linear low thermal expansion in a wide temperature range. The highly fine eutectic copper lamellae construct high thermal conductivity networks within (Zr,Nb)Fe2, serving as highways for heat transfer electrons and phonons. The in situ forming of eutectic copper lamellae also facilitates the mechanical properties by enhancing interfacial bonding and bearing additional stress after yielding of (Zr,Nb)Fe2. This work provides a novel strategy for promoting thermal conductivity and mechanical properties of negative thermal expansion alloys via eutectic precipitation of copper networks. |
| format | Article |
| id | doaj-art-df3aa974cfeb458bb2ff3dfa7d12c70d |
| institution | OA Journals |
| issn | 2198-3844 |
| language | English |
| publishDate | 2024-10-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advanced Science |
| spelling | doaj-art-df3aa974cfeb458bb2ff3dfa7d12c70d2025-08-20T02:11:59ZengWileyAdvanced Science2198-38442024-10-011140n/an/a10.1002/advs.202404838Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper NetworksMinjun Ai0Yuzhu Song1Feixiang Long2Yuanpeng Zhang3Ke An4Dunji Yu5Yan Chen6Yuki Sakai7Masahito Ikeda8Kazuki Takahashi9Masaki Azuma10Naike Shi11Chang Zhou12Jun Chen13Department of Physical Chemistry Beijing Advanced Innovation Center for Materials Genome Engineering University of Science and Technology Beijing Beijing 100083 ChinaDepartment of Physical Chemistry Beijing Advanced Innovation Center for Materials Genome Engineering University of Science and Technology Beijing Beijing 100083 ChinaDepartment of Physical Chemistry Beijing Advanced Innovation Center for Materials Genome Engineering University of Science and Technology Beijing Beijing 100083 ChinaNeutron Scattering Division Oak Ridge National Laboratory Oak Ridge TN 37831 USANeutron Scattering Division Oak Ridge National Laboratory Oak Ridge TN 37831 USANeutron Scattering Division Oak Ridge National Laboratory Oak Ridge TN 37831 USANeutron Scattering Division Oak Ridge National Laboratory Oak Ridge TN 37831 USAKanagawa Institute of Industrial Science and Technology (KISTEC) 705‐1 Shimoimaizumi Ebina Kanagawa 243‐0435 JapanLaboratory for Materials and Structures Institute of Innovative Research Tokyo Institute of Technology Yokohama 226‐8503 JapanLaboratory for Materials and Structures Institute of Innovative Research Tokyo Institute of Technology Yokohama 226‐8503 JapanKanagawa Institute of Industrial Science and Technology (KISTEC) 705‐1 Shimoimaizumi Ebina Kanagawa 243‐0435 JapanDepartment of Physical Chemistry Beijing Advanced Innovation Center for Materials Genome Engineering University of Science and Technology Beijing Beijing 100083 ChinaDepartment of Physical Chemistry Beijing Advanced Innovation Center for Materials Genome Engineering University of Science and Technology Beijing Beijing 100083 ChinaDepartment of Physical Chemistry Beijing Advanced Innovation Center for Materials Genome Engineering University of Science and Technology Beijing Beijing 100083 ChinaAbstract Rapid advancements in electronic devices yield an urgent demand for high‐performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the requirements simultaneously. Here, an effective strategy is proposed for significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy (Zr,Nb)Fe2 through eutectic precipitation of copper networks. The eutectic dual‐phase alloy exhibits an isotropic chips‐matched thermal expansion coefficient and a thermal conductivity enhancement exceeding 200% compared with (Zr,Nb)Fe2, along with an ultimate compressive strength of 550 MPa. The addition of copper reorganizes the composition of (Zr,Nb)Fe2, which smooths the magnetic transition and shifts it toward higher temperature, resulting in linear low thermal expansion in a wide temperature range. The highly fine eutectic copper lamellae construct high thermal conductivity networks within (Zr,Nb)Fe2, serving as highways for heat transfer electrons and phonons. The in situ forming of eutectic copper lamellae also facilitates the mechanical properties by enhancing interfacial bonding and bearing additional stress after yielding of (Zr,Nb)Fe2. This work provides a novel strategy for promoting thermal conductivity and mechanical properties of negative thermal expansion alloys via eutectic precipitation of copper networks.https://doi.org/10.1002/advs.202404838copper networkseutectic precipitationhigh thermal conductivitynegative thermal expansion |
| spellingShingle | Minjun Ai Yuzhu Song Feixiang Long Yuanpeng Zhang Ke An Dunji Yu Yan Chen Yuki Sakai Masahito Ikeda Kazuki Takahashi Masaki Azuma Naike Shi Chang Zhou Jun Chen Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks Advanced Science copper networks eutectic precipitation high thermal conductivity negative thermal expansion |
| title | Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks |
| title_full | Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks |
| title_fullStr | Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks |
| title_full_unstemmed | Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks |
| title_short | Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks |
| title_sort | significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy via in situ precipitation of copper networks |
| topic | copper networks eutectic precipitation high thermal conductivity negative thermal expansion |
| url | https://doi.org/10.1002/advs.202404838 |
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