Strain engineering of microfabricated diamond and its applications
Diamond is considered the ultimate semiconductor material due to its excellent physical and electrical properties, such as ultrahigh thermal conductivity, ultrawide bandgap, and superhigh carrier mobility. After ultralarge deformation experimentally conducted on diamond in 2018 and 2021, strain engi...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2025-06-01
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| Series: | APL Materials |
| Online Access: | http://dx.doi.org/10.1063/5.0268185 |
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