Characterization of electrolytically developed copper filled epoxy adhesive for space applications
The pursuit of advanced materials for space applications accelerates the development of new materials that exhibits excellent thermal, mechanical, and electrical properties under extreme environments. This study focuses on optimizing copper loading levels within epoxy matrices (ranging from 35 % to...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Hybrid Advances |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2773207X24002239 |
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