Nonlinear Elastoplastic Response and Damage Modeling in Power Electronics Packages Under Thermal Cycling

Nonlinear Elastoplastic Response and Damage Modeling in Power Electronics Packages Under Thermal Cycling

One of the common reliability tests performed on power modules for automotive applications is passive thermal cycling, which is conventionally representative of the highly demanding thermomechanical loads typical of steady-state operating conditions. The mechanical response of the electronics device...

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Bibliographic Details
Main Authors: Giuseppe Mirone, Raffaele Barbagallo, Luca Corallo, Giuseppe Bua, Guido La Rosa, Giovanna Fargione, Fabio Giudice
Format: Article
Language:English
Published: MDPI AG 2025-04-01
Series:Engineering Proceedings
Subjects:
delamination
damage
interface failure
power electronics packages
FEM simulation
cohesive zone model
Online Access:https://www.mdpi.com/2673-4591/85/1/50
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