APA (7th ed.) Citation

Zhang, Y., Shi, P., Chen, L., & Tang, Q. Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation. Wiley.

Chicago Style (17th ed.) Citation

Zhang, Yu, Peixin Shi, Lijuan Chen, and Qiang Tang. Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation. Wiley.

MLA (9th ed.) Citation

Zhang, Yu, et al. Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation. Wiley.