Effect of ultrasound in the bonding process of MB8/Cu/2024 dissimilar alloys
Ultrasonic-assisted transient liquid phase (U-TLP) bonding was used to realize the fast and reliable bonding of MB8/Cu/2024 dissimilar alloys in air. The joining process was divided into three stages, solid/solid interface stage-acoustic-induced stripping of metal particles and removal of oxide film...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing House
2025-01-01
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| Series: | Hanjie xuebao |
| Subjects: | |
| Online Access: | https://doi.org/10.12073/j.hjxb.20231107001 |
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