APA (7th ed.) Citation

Kim, Y. Measurement and Analysis of Interconnects’ Resonance and Signal/Power Integrity Degradation in Glass Packages. MDPI AG.

Chicago Style (17th ed.) Citation

Kim, Youngwoo. Measurement and Analysis of Interconnects’ Resonance and Signal/Power Integrity Degradation in Glass Packages. MDPI AG.

MLA (9th ed.) Citation

Kim, Youngwoo. Measurement and Analysis of Interconnects’ Resonance and Signal/Power Integrity Degradation in Glass Packages. MDPI AG.

Warning: These citations may not always be 100% accurate.