Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging
Abstract Internal insulation of high‐voltage power modules is facing interesting failure risks, including high temperature overheating, breakdown fault, material cracking etc., so it is imperative to urgently develop new dielectric materials with high thermal conductivity (λ), outstanding electrical...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2024-10-01
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| Series: | High Voltage |
| Online Access: | https://doi.org/10.1049/hve2.12443 |
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| author | Zhengdong Wang Ganqiu Yang Xiaolong Cao Mengli Li Tong Zhang Chenxin Liu Yuanhang Zhou Yonghong Cheng |
| author_facet | Zhengdong Wang Ganqiu Yang Xiaolong Cao Mengli Li Tong Zhang Chenxin Liu Yuanhang Zhou Yonghong Cheng |
| author_sort | Zhengdong Wang |
| collection | DOAJ |
| description | Abstract Internal insulation of high‐voltage power modules is facing interesting failure risks, including high temperature overheating, breakdown fault, material cracking etc., so it is imperative to urgently develop new dielectric materials with high thermal conductivity (λ), outstanding electrical insulation, and thermal stability properties. A method to construct controllable liquid crystalline cross‐linking networks based on the synthesis of biphenyl epoxy monomer and the change of curing agent structures and curing temperature is proposed. The uniform nematic rod‐like liquid crystalline domains were obtained by using 4,4‐diaminodiphenylmethane as a curing agent under a pre‐curing temperature of 105°C. The resulting film (abbreviated as TD‐105) exhibited λ up to 0.53 W m−1 K−1 and a dielectric breakdown strength of 57.69 kV mm−1, which showed a simultaneous enhancement of 178% and 16%, respectively, compared to traditional bisphenol A epoxy resin. Moreover, it also exhibited lower dielectric loss and magnitude of partial discharge while having higher glass‐transition temperature (190°C). A novel idea for the development of high‐performance epoxy insulating materials for the application of high‐voltage and large‐power electrical equipment is provided. |
| format | Article |
| id | doaj-art-d417f9bc047a4aa1b1ac20f6b6fdf65e |
| institution | OA Journals |
| issn | 2397-7264 |
| language | English |
| publishDate | 2024-10-01 |
| publisher | Wiley |
| record_format | Article |
| series | High Voltage |
| spelling | doaj-art-d417f9bc047a4aa1b1ac20f6b6fdf65e2025-08-20T02:12:14ZengWileyHigh Voltage2397-72642024-10-01951021103210.1049/hve2.12443Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packagingZhengdong Wang0Ganqiu Yang1Xiaolong Cao2Mengli Li3Tong Zhang4Chenxin Liu5Yuanhang Zhou6Yonghong Cheng7School of Mechanical and Electrical Engineering Xi'an University of Architecture and Technology Xi'an ChinaSchool of Mechanical and Electrical Engineering Xi'an University of Architecture and Technology Xi'an ChinaSchool of Mechanical and Electrical Engineering Xi'an University of Architecture and Technology Xi'an ChinaSchool of Mechanical and Electrical Engineering Xi'an University of Architecture and Technology Xi'an ChinaSchool of Mechanical and Electrical Engineering Xi'an University of Architecture and Technology Xi'an ChinaSchool of Mechanical and Electrical Engineering Xi'an University of Architecture and Technology Xi'an ChinaSchool of Mechanical and Electrical Engineering Xi'an University of Architecture and Technology Xi'an ChinaState Key Laboratory of Electrical Insulation and Power Equipment Xi'an Jiaotong University Xi'an ChinaAbstract Internal insulation of high‐voltage power modules is facing interesting failure risks, including high temperature overheating, breakdown fault, material cracking etc., so it is imperative to urgently develop new dielectric materials with high thermal conductivity (λ), outstanding electrical insulation, and thermal stability properties. A method to construct controllable liquid crystalline cross‐linking networks based on the synthesis of biphenyl epoxy monomer and the change of curing agent structures and curing temperature is proposed. The uniform nematic rod‐like liquid crystalline domains were obtained by using 4,4‐diaminodiphenylmethane as a curing agent under a pre‐curing temperature of 105°C. The resulting film (abbreviated as TD‐105) exhibited λ up to 0.53 W m−1 K−1 and a dielectric breakdown strength of 57.69 kV mm−1, which showed a simultaneous enhancement of 178% and 16%, respectively, compared to traditional bisphenol A epoxy resin. Moreover, it also exhibited lower dielectric loss and magnitude of partial discharge while having higher glass‐transition temperature (190°C). A novel idea for the development of high‐performance epoxy insulating materials for the application of high‐voltage and large‐power electrical equipment is provided.https://doi.org/10.1049/hve2.12443 |
| spellingShingle | Zhengdong Wang Ganqiu Yang Xiaolong Cao Mengli Li Tong Zhang Chenxin Liu Yuanhang Zhou Yonghong Cheng Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging High Voltage |
| title | Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging |
| title_full | Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging |
| title_fullStr | Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging |
| title_full_unstemmed | Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging |
| title_short | Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging |
| title_sort | dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high voltage power module packaging |
| url | https://doi.org/10.1049/hve2.12443 |
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