Wang, Z., Yang, G., Cao, X., Li, M., Zhang, T., Liu, C., . . . Cheng, Y. Dielectric and thermal properties characterisation and evaluation of novel epoxy materials for high‐voltage power module packaging. Wiley.
Chicago Style (17th ed.) CitationWang, Zhengdong, Ganqiu Yang, Xiaolong Cao, Mengli Li, Tong Zhang, Chenxin Liu, Yuanhang Zhou, and Yonghong Cheng. Dielectric and Thermal Properties Characterisation and Evaluation of Novel Epoxy Materials for High‐voltage Power Module Packaging. Wiley.
MLA (9th ed.) CitationWang, Zhengdong, et al. Dielectric and Thermal Properties Characterisation and Evaluation of Novel Epoxy Materials for High‐voltage Power Module Packaging. Wiley.
Warning: These citations may not always be 100% accurate.